Datasheet 57
Package Mechanical Specifications and Pin Information
Figure 14. Intel Core 2 Duo Mobile Processor (POP and LV) Die Micro-FCBGA Processor
Package Drawing
ø
0.14
A
A
B
L
C
ø
0.04
ø
0.46±0.04
(Metal Diameter)
ø
0.39±0.02
(Solder Resist Opening)
L
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