Intel LF80537GG0252M Datasheet download pdf (Page 103)

Datasheet

103

Thermal Specifications and Design Considerations

NOTES:

1. The TDP specification should be used to design the processor thermal solution. The TDP is

not the maximum theoretical power the processor can generate.

2. Not 100% tested. These power specifications are determined by characterization of the

processor currents at higher temperatures and extrapolating the values for the

temperature indicated.

3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal

Monitor’s automatic mode is used to indicate that the maximum T

has been reached.

Refer to Section 6.1 for more details.

4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate

within specifications.

5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser

than TDP in HFM.

6. At Tj of 105

7. At Tj of 50

8. At Tj of 35

Table 22. Power Specifications for the Dual-Core Low Power Standard Voltage

Processors (25W) in Standard Package

Symbol

Processor

Number

Core Frequency & Voltage

Thermal Design

Power

Unit Notes

TDP

P9700

P9600

P8800

P9500

P8700

P8600

P8400

2.8 GHz & V

CCHFM

2.667 GHz & V

CCHFM

2.667 GHz & V

CCHFM

2.53 GHz & V

CCHFM

2.53 GHz & V

CCHFM

2.4 GHz & V

CCHFM

2.267 GHz & V

CCHFM

1.6 GHz & V

CCLFM

0.8 GHz & V

CCSLFM

1, 4,

5, 6

Symbol Parameter Min Typ Max Unit Notes

AH,

SGNT

Auto Halt, Stop Grant Power

at V

CCHFM

at V

CCSLFM

——8.1

3.7

W2, 5, 7

SLP

Sleep Power

at V

CCHFM

at V

CCSLFM

——7.3

3.5

W2, 5, 7

DSLP

Deep Sleep Power

at V

CCHFM

at V

CCSLFM

——2.9

2.1

W2, 5, 8

DPRSLP

Deeper Sleep Power — — 1.0 W 2, 8

DC4

Intel® Enhanced Deeper Sleep State Power — — 0.9 W 2, 8

Intel® Deep Power Down Power — — 0.3 W 2, 8

Junction Temperature 0 — 105 °C3, 4

1 2 ... 98 99 100 101 102 103 104 105 106 107 108 ... 112 113

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