Intel LF80537GG0252M Datasheet download pdf (Page 105)

Datasheet

105

Thermal Specifications and Design Considerations

NOTES:

1. The TDP specification should be used to design the processor thermal solution. The TDP is not the

maximum theoretical power the processor can generate.

2. Not 100% tested. These power specifications are determined by characterization of the processor currents

at higher temperatures and extrapolating the values for the temperature indicated.

3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic

mode is used to indicate that the maximum T

has been reached.

4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within

specifications.

5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM.

6. At Tj of 105

7. At Tj of 50 °C

8. At Tj of 35

Table 24. Power Specifications fro the Dual-Core Low Voltage (LV) SFF Processors

Symbol

Processor

Number

Core Frequency & Voltage

Thermal Design

Power

Unit Notes

TDP

SL9600

SL9400

SL9300

2.13 GHz & HFM V

1.86 GHz & HFM VCC

1.6 GHz & HFM VCC

1.6 GHz & Super LFM VCC

0.8 GHz & Super LFM VCC

16.7

1, 4, 5,

Symbol Parameter Min Typ Max Unit Notes

AH,

SGNT

Auto Halt, Stop Grant Power

at V

CCHFM

at V

CCSLFM

——6.3

3.0

W2, 5, 7

SLP

Sleep Power

at V

CCHFM

at V

CCSLFM

——5.7

2.8

W2, 5, 7

DSLP

Deep Sleep Power

at V

CCHFM

at V

CCSLFM

——2.6

1.3

W2, 5, 8

DPRSLP

Deeper Sleep Power — — 0.9 W 2, 8

DC4

Intel® Enhanced Deeper Sleep State Power — — 0.8 W 2, 8

Intel® Deep Power Down Power — — 0.3 W 2, 8

Junction Temperature 0 — 105 °C3, 4

1 2 ... 100 101 102 103 104 105 106 107 108 109 110 111 112 113

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