Intel LF80537GG0252M Datasheet download pdf (Page 8)

Introduction

8 Datasheet

• Digital thermal sensor (DTS)

• Intel® 64 architecture

• Supports enhanced Intel® Virtualization Technology

• Enhanced Intel® Dynamic Acceleration Technology and Enhanced Multi-Threaded

Thermal Management (EMTTM)

• Supports PSI2 functionality

• SV processor offered in Micro-FCPGA and Micro-FCBGA packaging technologies

• Processor in POP, LV and ULV are offered in Micro-FCBGA packaging technologies

only

• Execute Disable Bit support for enhanced security

• Intel® Deep Power Down low-power state with P_LVL6 I/O support

• Support for Intel® Trusted Execution Technology

• Half ratio support (N/2) for core to bus ratio

1.1 Terminology

Term Definition

A “#” symbol after a signal name refers to an active low signal, indicating a

signal is in the active state when driven to a low level. For example, when

RESET# is low, a reset has been requested. Conversely, when NMI is high,

a nonmaskable interrupt has occurred. In the case of signals where the

name does not imply an active state but describes part of a binary

sequence (such as address or data), the “#” symbol implies that the signal

is inverted. For example, D[3:0] = “HLHL” refers to a hex ‘A’, and D[3:0]#

= “LHLH” also refers to a hex “A” (H= High logic level, L= Low logic level).

Front Side Bus

(FSB)

Refers to the interface between the processor and system core logic (also

known as the chipset components).

AGTL+

Advanced Gunning Transceiver Logic. Used to refer to Assisted GTL+

signaling technology on some Intel processors.

Storage

Conditions

Refers to a non-operational state. The processor may be installed in a

platform, in a tray, or loose. Processors may be sealed in packaging or

exposed to free air. Under these conditions, processor landings should not

be connected to any supply voltages, have any I/Os biased or receive any

clocks. Upon exposure to “free air” (i.e., unsealed packaging or a device

removed from packaging material) the processor must be handled in

accordance with moisture sensitivity labeling (MSL) as indicated on the

packaging material.

Enhanced Intel

SpeedStep®

Technology

Technology that provides power management capabilities to laptops.

Processor Core

Processor core die with integrated L1 and L2 cache. All AC timing and signal

integrity specifications are at the pads of the processor core.

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Intel LF80537GG0252M Datasheet Page 8

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