Intel LF80537GG0252M Datasheet Page 52

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Package Mechanical Specifications and Pin Information
52 Datasheet
Figure 9. 6-MB and 3-MB on 6-MB Die Micro-FCPGA Package Drawing (Sheet 1 of 2)
B6887-01
D76563(1)
TOP VIEW
FRONT VIEW
SIDE VIEW
BOTTOM VIEW
DETAIL
A
SCALE 20
F
3
F
2
C
Package Substrate
Underfill
Die
0.37 MAX
0.65 MAX
0.65 MAX
2.03±0.08
P
A
478 PINS
B
A
B
2
B
1
C
2
C
1
H
2
J
1
J
2
G
2
H
1
G
1
B
1
34.95
34.95 35.05
1.862 2.102
0.255 0.355
35.05
SYMBOL
COMMENTS
MILLIMETERS
MIN MAX
B
2
12.4
C
2
8.7
C
1
0.88
F
2
31.75 BASIC
G
2
31.75 BASIC
G
1
15.875 BASIC
H
2
15.875 BASIC
H
1
6g
Keying Pins A1, A2
W
P
1.27 BASIC
J
2
1.27 BASIC
J
1
F
3
ø
0.356
C
C
A
M
B
ø
0.254
M
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