Intel LF80537GG0252M Datasheet download pdf (Page 3)

Datasheet 3

Contents

1Introduction..............................................................................................................7

1.1 Terminology .......................................................................................................8

1.2 References .........................................................................................................9

2 Low Power Features ................................................................................................ 11

2.1 Clock Control and Low-Power States .................................................................... 11

2.1.1 Core Low-Power State Descriptions........................................................... 13

2.1.1.1 Core C0 State........................................................................... 13

2.1.1.2 Core C1/AutoHALT Powerdown State ........................................... 13

2.1.1.3 Core C1/MWAIT Powerdown State............................................... 14

2.1.1.4 Core C2 State........................................................................... 14

2.1.1.5 Core C3 State........................................................................... 14

2.1.1.6 Core C4 State........................................................................... 14

2.1.1.7 Core Deep Power Down Technology (Code Name C6) State ............ 15

2.1.2 Package Low-power State Descriptions...................................................... 15

2.1.2.1 Normal State............................................................................ 15

2.1.2.2 Stop-Grant State ...................................................................... 15

2.1.2.3 Stop-Grant Snoop State............................................................. 16

2.1.2.4 Sleep State .............................................................................. 16

2.1.2.5 Deep Sleep State...................................................................... 16

2.1.2.6 Deeper Sleep State ................................................................... 17

2.2 Enhanced Intel SpeedStep® Technology .............................................................. 19

2.3 Extended Low-Power States................................................................................ 20

2.4 FSB Low Power Enhancements ............................................................................ 21

2.4.1 Dynamic FSB Frequency Switching ........................................................... 21

2.4.2 Enhanced Intel® Dynamic Acceleration Technology .................................... 22

2.5 VID-x .............................................................................................................. 23

2.6 Processor Power Status Indicator (PSI-2) Signal .................................................... 23

3 Electrical Specifications ........................................................................................... 25

3.1 Power and Ground Pins ...................................................................................... 25

3.2 Decoupling Guidelines........................................................................................ 25

3.2.1 VCC

Decoupling...................................................................................... 25

3.2.2 FSB AGTL+ Decoupling ........................................................................... 25

3.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking........................................... 25

3.3 Voltage Identification and Power Sequencing ........................................................ 26

3.4 Catastrophic Thermal Protection .......................................................................... 29

3.5 Reserved and Unused Pins.................................................................................. 29

3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................ 29

3.7 FSB Signal Groups............................................................................................. 30

3.8 CMOS Signals ................................................................................................... 31

3.9 Maximum Ratings.............................................................................................. 31

3.10 Processor DC Specifications ................................................................................ 32

4 Package Mechanical Specifications and Pin Information .......................................... 51

4.1 Package Mechanical Specifications ....................................................................... 51

4.2 Processor Pinout and Pin List .............................................................................. 59

4.3 Alphabetical Signals Reference ............................................................................ 93

5 Thermal Specifications and Design Considerations ................................................ 101

5.1 Monitoring Die Temperature ............................................................................. 108

5.1.1 Thermal Diode ..................................................................................... 108

5.1.2 Intel® Thermal Monitor......................................................................... 109

1 2 3 4 5 6 7 8 ... 112 113

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Intel LF80537GG0252M Datasheet Page 3

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