Intel S1155 User Manual Page 70
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Sensor Based Thermal Specification Design Guidance
70 Thermal/Mechanical Specifications and Design Guidelines
• When the DTS value is at or below T
CONTROL
, the fans can be slowed down - just as
with prior processors.
• When DTS is above T
CONTROL
, FSC algorithms will use knowledge of T
AMBIENT
and
Ψ
CA
vs. RPM to achieve the necessary level of cooling.
DTS 1.1 provides another option to do fan speed control without the Tambient data.
Please refer to Section 8.4.1 for more details.This chapter will discuss two
implementations. The first is a FSC system that is not provided the T
AMBIENT
information and a FSC system that is provided data on the current T
AMBIENT
. Either
method will result in a thermally compliant solution and some acoustic benefit by
operating the processor closer to the thermal profile. But only the T
AMBIENT
aware FSC
system can fully utilize the specification for optimized acoustic performance.
In the development of the FSC algorithm it should be noted that the T
AMBIENT
is
expected to change at a significantly slower rate than the DTS value. The DTS value will
be driven by the workload on the processor and the thermal solution will be required to
respond to this much more rapidly than the changes in T
AMBIENT
.
An additional consideration in establishing the fan speed curves is to account for the
thermal interface material performance degradation over time.
- Legal Lines and Disclaime rs 2
- Contents 3
- Revision History 8
- 1 Introduction 9
- 1.1 References 10
- 1.2 Definition of Terms 10
- Introduction 12
- Specifications 13
- 37.5 14
- 2.1.7 Processor Materials 16
- 2.1.8 Processor Markings 16
- Table 2-4. Storage Conditions 18
- 3 LGA1155 Socket 19
- 3.1 Board Layout 20
- 122.6 mil (3.1144mm) 21
- 36mil (0.9144 mm) 21
- 3.2 Attachment to Motherboard 22
- 3.3 Socket Components 23
- 3.5 Durability 25
- 3.6 Markings 25
- 3.8 Socket Size 26
- 4 Independent Loading 27
- Shoulder 30
- 6-32 thread 30
- Figure 4-4. ILM Assembly 31
- Load plate not 32
- 4.5 ILM Cover 33
- Step 3: Close ILM 34
- Step 1: PnP Cover installed 34
- Step 2: Remove PnP Cover 34
- 5 LGA1155 Socket and ILM 37
- 5.3 Loading Specifications 38
- 5.4 Electrical Requirements 38
- 6 Thermal Specifications 41
- 6.1.1 Intel 43
- 6.1.2 Intel 44
- Processor E3-1200 45
- 6.1.3 Intel 46
- 6.1.4 Intel 47
- 6.1.5 Intel 48
- Graphics Thermal Profile 48
- Thermal Sensor Exceeds T 49
- 6.1.7 Thermal Metrology 54
- 6.2.1 Processor Temperature 54
- 6.2.2.1 Frequency/VID Control 55
- 6.2.2.2 Clock Modulation 56
- 6.2.2.5 PROCHOT# Signal 57
- 6.3 Intel 58
- Turbo Boost Technology 58
- 6.4 Thermal Considerations 59
- 6.4.1 Intel 60
- Reporting 60
- System Thermal Response Time 61
- Turbo Algorithm Response Time 61
- Thermal Specifications 62
- 7 PECI Interface 63
- PECI Interface 64
- 8 Sensor Based Thermal 65
- 8.2.1 TTV Thermal Profile 67
- = (TTV T 69
- ) / Power 69
- 8.5 System Validation 73
- 9 1U Thermal Solution 75
- 1U Thermal Solution 76
- CASE_MAX 77
- 9.2.2 Thermal Solution 78
- 9.2.3 Assembly 79
- 9.3 1U Reference Heatsink 80
- 9.3.3 Assembly 81
- Die Centerline 82
- Package Centerline 82
- Active Tower Thermal Solution 83
- 10.3 Electrical Requirements 85
- 10.4 Cooling Requirements 87
- Thermal Solution Quality and 89
- Reliability Requirements 89
- A Component Suppliers 93
- B Mechanical Drawings 95
- TOP SIDE 98
- BOTTOM SIDE 98
- DETAIL A 99
- Mechanical Drawings 100
- C Socket Mechanical Drawings 115
- Socket Mechanical Drawings 116
- D Package Mechanical 121
- Drawings 121
- Package Mechanical Drawings 122
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