Intel S1155 User Manual download pdf (Page 25)

Thermal/Mechanical Specifications and Design Guidelines 25

LGA1155 Socket

3.4.1 Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after

solder reflow and are specified in Appendix C.

Similarly, a seating plane on the topside of the socket establishes the minimum

package height. See Section 5.2 for the calculated IHS height above the motherboard.

3.5 Durability

The socket must withstand 20 cycles of processor insertion and removal. The max

chain contact resistance from Tabl e 5 - 4 must be met when mated in the 1st and

20th cycles.

The socket Pick and Place cover must withstand 15 cycles of insertion and removal.

3.6 Markings

There are three markings on the socket:

• LGA1155: Font type is Helvetica Bold - minimum 6 point (2.125 mm). This mark

will also appear on the pick and place cap.

• Manufacturer's insignia (font size at supplier's discretion).

• Lot identification code (allows traceability of manufacturing date and location).

Figure 3-7. Package Installation / Removal Features

Pin 1

Chamfer

Package

Pin 1

Indicator

Alignment

Post

(2 Places)

Finger/Tool

Access

(2 Places)

Orientation

Notch

(2 Places)

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Intel S1155 User Manual Page 25