Intel S1155 User Manual download pdf (Page 42)

Thermal Specifications

42 Thermal/Mechanical Specifications and Design Guidelines

Section 6.2. To ensure maximum flexibility for future processors, systems should be

designed to the Thermal Solution Capability guidelines, even if a processor with lower

power dissipation is currently planned.

Notes:

1. The package C-state power is the worst case power in the system configured as follows:

- Memory configured for DDR3 1333 and populated with 2 DIMM per channel.

- DMI and PCIe links are at L1.

2. Specification at Tj of 50 °C and minimum voltage loadline.

3. Specification at Tj of 35 °C and minimum voltage loadline.

4. These values are specified at V

CC_MAX

and V

NOM

for all other voltage rails for all processor frequencies.

Systems must be designed to ensure the processor is not to be subjected to any static V

and I

combination wherein V

CCP

exceeds V

CCP_MAX

at specified I

CCP

. Please refer to the loadline specifications in

the datasheet.

5. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the

maximum power that the processor can dissipate. TDP is measured at DTS = -1.

TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel.

6. Not 100% tested. Specified by design characterization.

7. When the Multi-monitor feature is enabled (running 4 displays simultaneously) there could be corner cases

with additional system thermal impact on the SA and VCCP rails ≤1.5W (maximum of 1.5W measured on

16 lane PCIe card). The integrator should perform additional thermal validation with Multi-monitor enabled

to ensure thermal compliance.

8. Guidelines provide a design target for meeting all planned processor frequency requirements. For more

detailed definition, please refer to latest processor Datasheet.

Table 6-1. Processor Thermal Specifications

Product Guidelines

Max

Power

Package

C1E

(W)

1,2,6

Max

Power

Package

(W)

1,2,6

Max

Power

Package

(W)

1,3,6

TTV

Thermal

Design

Power

(W)

4,5,7

Min T

CASE

(°C)

Maximum

TTV TCASE

(°C)

Intel

Xeon

Processor E3-

1280 (95W)

2011D 28 22 5.5 95

Figure 6-1

&Tab l e 6 -2

Intel

Xeon

processor E3-

1200 (80W)

2011D 28 22 5.5 80

Figure 6-2&

Tabl e 6 -3

Intel

Xeon

processor E3-

1260L (45W)

2011B 20 12 5.5 45

Figure 6-3&

Tabl e 6 -4

Intel

Xeon

processor E3-

1220L (20W)

2011A 18 10 5 20

Figure 6-4&

Tabl e 6 -5

Intel

Xeon

processor E3-

1200 (95W)

with integrated

graphics

2011D 28 22 5.5 95

Figure 6-5&

Tabl e 6 -6

1 2 ... 37 38 39 40 41 42 43 44 45 46 47 ... 123 124

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