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Thermal Specifications

54 Thermal/Mechanical Specifications and Design Guidelines

6.1.7 Thermal Metrology

The maximum TTV case temperatures (T

CASE-MAX

) can be derived from the data in the

appropriate TTV thermal profile earlier in this chapter. The TTV T

CASE

is measured at the

geometric top center of the TTV integrated heat spreader (IHS). Figure 6-6 illustrates

the location where T

CASE

temperature measurements should be made. See Figure B-17

for drawing showing the thermocouple attach to the TTV package.

Note: The following supplier can machine the groove and attach a thermocouple to the IHS.

The supplier is listed below as a convenience to Intel’s general customers and the list

may be subject to change without notice. THERM-X OF CALIFORNIA Inc, 3200

Investment Blvd., Hayward, Ca 94545. Ernesto B Valencia +1-510-441-7566 Ext. 242

ernestov@therm-x.com. The vendor part number is XTMS1565.

6.2 Processor Thermal Features

6.2.1 Processor Temperature

A new feature in the processors is a software readable field in the

IA32_TEMPERATURE_TARGET register that contains the minimum temperature at

which the TCC will be activated and PROCHOT# will be asserted. The TCC activation

temperature is calibrated on a part-by-part basis and normal factory variation may

result in the actual TCC activation temperature being higher than the value listed in the

frequency or manufacturing efficiencies.

6.2.2 Adaptive Thermal Monitor

The Adaptive Thermal Monitor feature provides an enhanced method for controlling the

processor temperature when the processor silicon exceeds the Thermal Control Circuit

(TCC) activation temperature. Adaptive Thermal Monitor uses TCC activation to reduce

processor power via a combination of methods. The first method (Frequency/VID

Figure 6-6. TTV Case Temperature (T

CASE

) Measurement Location

37.5

Measure T

CASE

the geometric

center of the

package

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Intel S1155 User Manual Page 54