Intel S1155 User Manual download pdf (Page 14)

Package Mechanical & Storage Specifications

14 Thermal/Mechanical Specifications and Design Guidelines

2.1.1 Package Mechanical Drawing

Figure 2-2 shows the basic package layout and dimensions. The detailed package

mechanical drawings are in Appendix D. The drawings include dimensions necessary to

design a thermal solution for the processor. These dimensions include:

1. Package reference with tolerances (total height, length, width, and so on)

2. IHS parallelism and tilt

3. Land dimensions

4. Top-side and back-side component keep-out dimensions

5. Reference datums

6. All drawing dimensions are in mm.

2.1.2 Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep-

out zone requirements. A thermal and mechanical solution design must not intrude into

the required keep-out zones. Decoupling capacitors are typically mounted to either the

topside or land-side of the package substrate. See Figure B-3 and Figure B-4 for keep-

out zones. The location and quantity of package capacitors may change due to

manufacturing efficiencies but will remain within the component keep-in. This keep-in

zone includes solder paste and is a post reflow maximum height for the components.

Figure 2-2. Package View

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Intel S1155 User Manual Page 14