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Thermal/Mechanical Specifications and Design Guidelines 69
Sensor Based Thermal Specification Design Guidance
8.3.2 Thermal Design and Modelling
Based on the boundary conditions, the designer can now make the design selection of
the thermal solution components. The major components that can be mixed are the
fan, fin geometry, heat pipe or air duct design. There are cost and acoustic trade-offs
the customer can make.
To aide in the design process Intel provides TTV thermal models. Please consult your
Intel Field Sales Engineer for these tools.
8.3.3 Thermal Solution Validation
8.3.3.1 Test for Compliance to the TTV Thermal Profile
This step is the same as previously suggested for prior products. The thermal solution
is mounted on a test fixture with the TTV and tested at the following conditions:
• TTV is powered to the TDP condition
• Maximum airflow through heatsink
•T
AMBIENT
at the boundary condition from Section 8.3.1
The following data is collected: TTV power, TTV T
CASE
and T
AMBIENT
. and used to
calculate Ψ
CA
which is defined as:
Ψ
CA
= (TTV T
CASE
- T
AMBIENT
) / Power
This testing is best conducted on a bench to eliminate as many variables as possible
when assessing the thermal solution performance. The boundary condition analysis as
described in Section 8.3.1 should help in making the bench test simpler to perform.
8.3.3.2 Thermal Solution Characterization for Fan Speed Control
The final step in thermal solution validation is to establish the thermal solution
performance,Ψ
CA
and acoustics as a function of fan speed. This data is necessary to
allow the fan speed control algorithm developer to program the device. It also is
needed to asses the expected acoustic impact of the processor thermal solution in the
system.
The fan speed control device may modulate the thermal solution fan speed (RPM) by
one of two methods. The first and preferred is pulse width modulation (PWM) signal
compliant to the 4-Wire Pulse Width Modulation (PWM) Controlled Fans specification.
The alternative is varying the input voltage to the fan. As a result the characterization
data needs to also correlate the RPM to PWM or voltage to the thermal solution fan. The
fan speed algorithm developer needs to associate the output command from the fan
speed control device with the required thermal solution performance. Regardless of
which control method is used, the term RPM will be used to indicate required fan speed
in the rest of this document.
8.4 Fan Speed Control (FSC) Design Process
The next step is to incorporate the thermal solution characterization data into the
algorithms for the device controlling the fans.
As a reminder the requirements are:
- Legal Lines and Disclaime rs 2
- Contents 3
- Revision History 8
- 1 Introduction 9
- 1.1 References 10
- 1.2 Definition of Terms 10
- Introduction 12
- Specifications 13
- 37.5 14
- 2.1.7 Processor Materials 16
- 2.1.8 Processor Markings 16
- Table 2-4. Storage Conditions 18
- 3 LGA1155 Socket 19
- 3.1 Board Layout 20
- 122.6 mil (3.1144mm) 21
- 36mil (0.9144 mm) 21
- 3.2 Attachment to Motherboard 22
- 3.3 Socket Components 23
- 3.5 Durability 25
- 3.6 Markings 25
- 3.8 Socket Size 26
- 4 Independent Loading 27
- Shoulder 30
- 6-32 thread 30
- Figure 4-4. ILM Assembly 31
- Load plate not 32
- 4.5 ILM Cover 33
- Step 3: Close ILM 34
- Step 1: PnP Cover installed 34
- Step 2: Remove PnP Cover 34
- 5 LGA1155 Socket and ILM 37
- 5.3 Loading Specifications 38
- 5.4 Electrical Requirements 38
- 6 Thermal Specifications 41
- 6.1.1 Intel 43
- 6.1.2 Intel 44
- Processor E3-1200 45
- 6.1.3 Intel 46
- 6.1.4 Intel 47
- 6.1.5 Intel 48
- Graphics Thermal Profile 48
- Thermal Sensor Exceeds T 49
- 6.1.7 Thermal Metrology 54
- 6.2.1 Processor Temperature 54
- 6.2.2.1 Frequency/VID Control 55
- 6.2.2.2 Clock Modulation 56
- 6.2.2.5 PROCHOT# Signal 57
- 6.3 Intel 58
- Turbo Boost Technology 58
- 6.4 Thermal Considerations 59
- 6.4.1 Intel 60
- Reporting 60
- System Thermal Response Time 61
- Turbo Algorithm Response Time 61
- Thermal Specifications 62
- 7 PECI Interface 63
- PECI Interface 64
- 8 Sensor Based Thermal 65
- 8.2.1 TTV Thermal Profile 67
- = (TTV T 69
- ) / Power 69
- 8.5 System Validation 73
- 9 1U Thermal Solution 75
- 1U Thermal Solution 76
- CASE_MAX 77
- 9.2.2 Thermal Solution 78
- 9.2.3 Assembly 79
- 9.3 1U Reference Heatsink 80
- 9.3.3 Assembly 81
- Die Centerline 82
- Package Centerline 82
- Active Tower Thermal Solution 83
- 10.3 Electrical Requirements 85
- 10.4 Cooling Requirements 87
- Thermal Solution Quality and 89
- Reliability Requirements 89
- A Component Suppliers 93
- B Mechanical Drawings 95
- TOP SIDE 98
- BOTTOM SIDE 98
- DETAIL A 99
- Mechanical Drawings 100
- C Socket Mechanical Drawings 115
- Socket Mechanical Drawings 116
- D Package Mechanical 121
- Drawings 121
- Package Mechanical Drawings 122
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