Intel S1155 User Manual Page 98
- Page / 124
- Table of contents
- BOOKMARKS
Rated. / 5. Based on customer reviews
Mechanical Drawings
98 Thermal/Mechanical Specifications and Design Guidelines
Figure B-3. Socket / Processor / ILM Keepout Zone Primary Side for 1U (Top)
A
A
B
B
DEPARTMENT
R
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
PST-TMI
TITLE
LGA1156 & 1155 SOCKET,
ILM & PROCESSOR KEEPIN
SIZE DRAWING NUMBER REV
A1
E21320
J
SCALE: 1.000
DO NOT SCALE DRAWING
SHEET 1 OF 2
51.00
70.37
17.00
7170.0
()15.16
8.12
49.50
3.75
11.75
9.26
9.26
8.97
8.97
6.55
3X 6.34
6.76
6.76
1.25
13.00
5.50
40.71
37.54
()78.25
CLEARANCE NEEDED
FOR WIRE TRAVEL
3.75
4.00
8130.0
618.72
6
27.33
3.18
3.18
15.92
19.50
()42.50
()42.50
4.00
1.75
7.00
()
TYP PCB THICKNESS
1.50
2.50
()49.50
2.50
28.12
42.50
21.25
()94.76
78.25
3X 2.58
3X 5.00
12.29
19.99
B
C
C
B
B
C
C
(R )65.21
(R )46.51
()37.54
()2.50
()1.50
NOTES:
1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC
CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNS
WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP-INS).
2 SOCKET KEEP-IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET
AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSITION.
IT ENCOMPASSES SOCKET AND CPU PACKAGE DIMENSIONAL TOLERANCES
AND DEFLECTION / SHAPE CHANGES DUE TO ILM LOAD.
3. SOCKET KEEP-IN VOLUME ENCOMPASS THE SOCKET NOMINAL VOLUME
AND ALLOWANCES FOR SIZE TOLERANCES. THERMAL/MECHANICAL COMPONENT
DEVELOPERS SHALL DESIGN TO THE OUTSIDE OF SOCKET KEEP IN VOLUME WITH
CLEARANCE MARGINS. SOCKET DEVELOPERS SHALL DESIGN TO THE INSIDE VOLUME.
4.DIMENSIONS ARE IN MILLIMETERS
5 NO COMPONENT BOUNDARY-FINGER ACCESS AREA
6 MOTHERBOARD BACKSIDE COMPONENT KEEP-IN
7 MAXIMUM OPEN ANGLE TO OPEN LOAD PLATE
8 MINIMUM OPEN ANGLE TO CLEAR LOAD PLATE
TOP SIDE
BOTTOM SIDE
1
2
SECTION A-A
SECTION B-B
SEE DETAIL A
5
MAX LEVER MOTION SPACE
TO LEVER STOP
7
LOAD PLATE OPENING
MOTION SPACE
MIN LEVER MOTION SPACE
TO OPEN LID
8
PRIMARY SIDE COMPONENT
CLEARANCE
LEVER UNLATCHED
POSITION
SECONDARY SIDE
COMPONENT CLEARANCE
SEE DETAIL A
- Legal Lines and Disclaime rs 2
- Contents 3
- Revision History 8
- 1 Introduction 9
- 1.1 References 10
- 1.2 Definition of Terms 10
- Introduction 12
- Specifications 13
- 37.5 14
- 2.1.7 Processor Materials 16
- 2.1.8 Processor Markings 16
- Table 2-4. Storage Conditions 18
- 3 LGA1155 Socket 19
- 3.1 Board Layout 20
- 122.6 mil (3.1144mm) 21
- 36mil (0.9144 mm) 21
- 3.2 Attachment to Motherboard 22
- 3.3 Socket Components 23
- 3.5 Durability 25
- 3.6 Markings 25
- 3.8 Socket Size 26
- 4 Independent Loading 27
- Shoulder 30
- 6-32 thread 30
- Figure 4-4. ILM Assembly 31
- Load plate not 32
- 4.5 ILM Cover 33
- Step 3: Close ILM 34
- Step 1: PnP Cover installed 34
- Step 2: Remove PnP Cover 34
- 5 LGA1155 Socket and ILM 37
- 5.3 Loading Specifications 38
- 5.4 Electrical Requirements 38
- 6 Thermal Specifications 41
- 6.1.1 Intel 43
- 6.1.2 Intel 44
- Processor E3-1200 45
- 6.1.3 Intel 46
- 6.1.4 Intel 47
- 6.1.5 Intel 48
- Graphics Thermal Profile 48
- Thermal Sensor Exceeds T 49
- 6.1.7 Thermal Metrology 54
- 6.2.1 Processor Temperature 54
- 6.2.2.1 Frequency/VID Control 55
- 6.2.2.2 Clock Modulation 56
- 6.2.2.5 PROCHOT# Signal 57
- 6.3 Intel 58
- Turbo Boost Technology 58
- 6.4 Thermal Considerations 59
- 6.4.1 Intel 60
- Reporting 60
- System Thermal Response Time 61
- Turbo Algorithm Response Time 61
- Thermal Specifications 62
- 7 PECI Interface 63
- PECI Interface 64
- 8 Sensor Based Thermal 65
- 8.2.1 TTV Thermal Profile 67
- = (TTV T 69
- ) / Power 69
- 8.5 System Validation 73
- 9 1U Thermal Solution 75
- 1U Thermal Solution 76
- CASE_MAX 77
- 9.2.2 Thermal Solution 78
- 9.2.3 Assembly 79
- 9.3 1U Reference Heatsink 80
- 9.3.3 Assembly 81
- Die Centerline 82
- Package Centerline 82
- Active Tower Thermal Solution 83
- 10.3 Electrical Requirements 85
- 10.4 Cooling Requirements 87
- Thermal Solution Quality and 89
- Reliability Requirements 89
- A Component Suppliers 93
- B Mechanical Drawings 95
- TOP SIDE 98
- BOTTOM SIDE 98
- DETAIL A 99
- Mechanical Drawings 100
- C Socket Mechanical Drawings 115
- Socket Mechanical Drawings 116
- D Package Mechanical 121
- Drawings 121
- Package Mechanical Drawings 122
Related products and manuals for Processors Intel S1155
Processors Intel i7-4770K User Manual
(120 pages)
(120 pages)
Processors Intel E3 User Manual
(116 pages)
(116 pages)
Processors Intel 80C186XL User Manual
(405 pages)
(405 pages)
Processors Intel mPGA604 User Manual
(52 pages)
(52 pages)
Processors Intel NetBurst User Manual
(17 pages)
(17 pages)
Processors Intel ARCHITECTURE IA-32 User Manual
(636 pages)
(636 pages)
Processors Intel Chipper 945GC User Manual
(39 pages)
(39 pages)
Processors Intel DBPXA210 User Manual
(24 pages)
(24 pages)
Processors Intel 8mb User Manual
(36 pages)
(36 pages)
Processors Intel I5 User Manual
(56 pages)
(56 pages)
Processors Intel 955X User Manual
(36 pages)
(36 pages)
Processors Intel CM8064301559301 Datasheet
(70 pages)
(70 pages)
Processors Intel GG8067401635553 Datasheet
(608 pages)
(608 pages)
Processors Intel CM8063601537106 Datasheet
(504 pages)
(504 pages)
Processors Intel CM8064601618605 Datasheet
(125 pages)
(125 pages)
Processors Intel CL8064701528402 Datasheet
(116 pages)
(116 pages)
Processors Intel CM8063501589600 Datasheet
(234 pages)
(234 pages)
Processors Intel CM8063101049806 Datasheet
(172 pages)
(172 pages)
© 2020, manymanuals.com. All rights reserved. | 1.892 s |
Manymanuals.com
Manymanuals.de
Manymanuals.fr
Manymanuals.it
Manymanuals.pl
Manymanuals.cz
Manymanuals.es
Manymanuals-pt.com
Comments to this Manuals