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Thermal/Mechanical Specifications and Design Guidelines 71
Sensor Based Thermal Specification Design Guidance
8.4.1 DTS 1.1 A New Fan Speed Control Algorithm without
T
AMBIENT
Data
In most system designs incorporating processor ambient inlet data in fan speed control
adds design and validation complexity with a possible BOM cost impact to the system.
A new fan speed control methodology is introduced to improve system acoustics
without needing the processor inlet ambient information.
The DTS 1.1 implementation consists of two parts, a Ψ
CA
requirement at T
CONTROL
and
a Ψ
CA
point at DTS = -1.
The Ψ
CA
point at DTS = -1 defines the minimum Ψ
CA
required at TDP considering the
worst case system design Tambient design point:
Ψ
CA
= (T
CASE_max
- T
Ambient target
) / TDP
For example, for a 95 TDP part, the Tcase max is 72.6C and at a worst case design
point of 40C local ambient this will result in
Ψ
CA
= (72.6 - 40) / 95 = 0.34 C/W
Similarly for a system with a design target of 45 C ambient the Ψ
CA
at DTS = -1 needed
will be 0.29 C/W.
The second point defines the thermal solution performance (Ψ
CA
) at T
CONTROL
.
Figure 8-1 lists the required Ψ
CA
for various TDP processors.
These two points define the operational limits for the processor for DTS 1.1
implementation. At T
CONTROL
the fan speed must be programed such that the resulting
Ψ
CA
is better than or equivalent to the required Ψ
CA
listed in Tab l e 8 - 1. Similarly the fan
speed should be set at DTS = -1 such that the thermal solution performance is better
than or equivalent to the
Ψ
CA
requirements at Tambient_Max. Based on the processor
temperature, the fan speed controller must linearly change the fan speed from DTS =
T
CONTROL
to DTS = -1 between these points. Figure 8-3 gives a visual description on
DTS 1.1.
- Legal Lines and Disclaime rs 2
- Contents 3
- Revision History 8
- 1 Introduction 9
- 1.1 References 10
- 1.2 Definition of Terms 10
- Introduction 12
- Specifications 13
- 37.5 14
- 2.1.7 Processor Materials 16
- 2.1.8 Processor Markings 16
- Table 2-4. Storage Conditions 18
- 3 LGA1155 Socket 19
- 3.1 Board Layout 20
- 122.6 mil (3.1144mm) 21
- 36mil (0.9144 mm) 21
- 3.2 Attachment to Motherboard 22
- 3.3 Socket Components 23
- 3.5 Durability 25
- 3.6 Markings 25
- 3.8 Socket Size 26
- 4 Independent Loading 27
- Shoulder 30
- 6-32 thread 30
- Figure 4-4. ILM Assembly 31
- Load plate not 32
- 4.5 ILM Cover 33
- Step 3: Close ILM 34
- Step 1: PnP Cover installed 34
- Step 2: Remove PnP Cover 34
- 5 LGA1155 Socket and ILM 37
- 5.3 Loading Specifications 38
- 5.4 Electrical Requirements 38
- 6 Thermal Specifications 41
- 6.1.1 Intel 43
- 6.1.2 Intel 44
- Processor E3-1200 45
- 6.1.3 Intel 46
- 6.1.4 Intel 47
- 6.1.5 Intel 48
- Graphics Thermal Profile 48
- Thermal Sensor Exceeds T 49
- 6.1.7 Thermal Metrology 54
- 6.2.1 Processor Temperature 54
- 6.2.2.1 Frequency/VID Control 55
- 6.2.2.2 Clock Modulation 56
- 6.2.2.5 PROCHOT# Signal 57
- 6.3 Intel 58
- Turbo Boost Technology 58
- 6.4 Thermal Considerations 59
- 6.4.1 Intel 60
- Reporting 60
- System Thermal Response Time 61
- Turbo Algorithm Response Time 61
- Thermal Specifications 62
- 7 PECI Interface 63
- PECI Interface 64
- 8 Sensor Based Thermal 65
- 8.2.1 TTV Thermal Profile 67
- = (TTV T 69
- ) / Power 69
- 8.5 System Validation 73
- 9 1U Thermal Solution 75
- 1U Thermal Solution 76
- CASE_MAX 77
- 9.2.2 Thermal Solution 78
- 9.2.3 Assembly 79
- 9.3 1U Reference Heatsink 80
- 9.3.3 Assembly 81
- Die Centerline 82
- Package Centerline 82
- Active Tower Thermal Solution 83
- 10.3 Electrical Requirements 85
- 10.4 Cooling Requirements 87
- Thermal Solution Quality and 89
- Reliability Requirements 89
- A Component Suppliers 93
- B Mechanical Drawings 95
- TOP SIDE 98
- BOTTOM SIDE 98
- DETAIL A 99
- Mechanical Drawings 100
- C Socket Mechanical Drawings 115
- Socket Mechanical Drawings 116
- D Package Mechanical 121
- Drawings 121
- Package Mechanical Drawings 122
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