Intel S1155 User Manual download pdf (Page 59)

Thermal/Mechanical Specifications and Design Guidelines 59

Thermal Specifications

• The number of cores operating in the C0 state.

• The estimated current consumption.

• The estimated power consumption.

•The temperature.

Any of these factors can affect the maximum frequency for a given workload. If the

power, current, or thermal limit is reached, the processor will automatically reduce the

frequency to stay with its TDP limit.

Note: Intel Turbo Boost Technology processor frequencies are only active if the operating

system is requesting the P0 state.

6.3.2 Intel

Turbo Boost Technology Graphics Frequency

Graphics render frequency is selected by the processor dynamically based on the

graphics workload demand. The processor can optimize both processor and integrated

graphics performance through managing total package power. For the integrated

graphics, this could mean an increase in the render core frequency (above its base

frequency) and increased graphics performance. In addition, the processor core can

increase its frequency higher than it would without power sharing.

Enabling Intel

Turbo Boost Technology will maximize the performance of the

processor core and the graphics render frequency within the specified package power

levels. Compared with previous generation products, Intel

Turbo Boost Technology

will increase the ratio of application power to TDP. Thus, thermal solutions and platform

cooling that are designed to less than thermal design guidance might experience

thermal and performance issues since more applications will tend to run at the

maximum power limit for significant periods of time.

6.4 Thermal Considerations

Intel Turbo Boost Technology allows processor cores and Processor Graphics cores to

run faster than the baseline frequency. During a turbo event, the processor can exceed

its TDP power for brief periods. Turbo is invoked opportunistically and automatically as

long as the processor is conforming to its temperature, power delivery, and current

specification limits. Thus, thermal solutions and platform cooling that are designed to

be less than thermal design guidance may experience thermal and performance issues

since more applications will tend to run at or near the maximum power limit for

significant periods of time.

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Intel S1155 User Manual Page 59