Intel S1155 User Manual download pdf (Page 89)

Thermal/Mechanical Specifications and Design Guidelines 89

Thermal Solution Quality and Reliability Requirements

11 Thermal Solution Quality and

Reliability Requirements

11.1 Reference Heatsink Thermal Verification

Each motherboard, heatsink and attach combination may vary the mechanical loading

of the component. Based on the end user environment, the user should define the

appropriate reliability test criteria and carefully evaluate the completed assembly prior

to use in high volume. The Intel reference thermal solution will be evaluated to the

boundary conditions in Chapter 5.

The test results, for a number of samples, are reported in terms of a worst-case mean

+ 3σ value for thermal characterization parameter using the TTV.

11.2 Mechanical Environmental Testing

Each motherboard, heatsink and attach combination may vary the mechanical loading

of the component. Based on the end user environment, the user should define the

appropriate reliability test criteria and carefully evaluate the completed assembly prior

to use in high volume. Some general recommendations are shown in Ta bl e 1 1 - 1.

The Intel reference heatsinks will be tested in an assembled to the LGA1155 socket and

mechanical test package. Details of the Environmental Requirements, and associated

stress tests, can be found in Tabl e 1 1- 1 are based on speculative use condition

assumptions, and are provided as examples only.

Notes:

1. It is recommended that the above tests be performed on a sample size of at least ten assemblies from

multiple lots of material.

2. Additional pass/fail criteria may be added at the discretion of the user.

Table 11-1. Use Conditions (Board Level)

Test

Requirement Pass/Fail Criteria

Mechanical Shock 3 drops each for + and - directions in each of 3

perpendicular axes (that is, total 18 drops)

Profile: 50 g, Trapezoidal waveform, 4.3 m/s [170 in/s]

minimum velocity change

Visual Check and

Electrical Functional

Tes t

Random Vibration Duration: 10 min/axis, 3 axes

Frequency Range: 5 Hz to 500 Hz

5 Hz @ 0.01 g

/Hz to 20 Hz @ 0.02 g

/Hz (slope up)

20 Hz to 500 Hz @ 0.02 g

/Hz (flat)

Power Spectral Density (PSD) Profile: 3.13 g RMS

Visual Check and

Electrical Functional

Tes t

Thermal Cycling –25°C to +100°C;Ramp rate ~ 8C/minute; Cycle time:~30

minutes per cycle for 500 cycles.

Visual Check and

Thermal Performance

Tes t

1 2 ... 84 85 86 87 88 89 90 91 92 93 94 ... 123 124

Comments to this Manuals

No comments

Intel S1155 User Manual Page 89

Comments to this Manuals

Related products and manuals for Processors Intel S1155