Intel 955X User Manual

Intel® 955X Express Chipset Thermal/Mechanical Design Guide – For the Intel® 82955X Memory Controller Hub (MCH) April 2005

Packaging Technology R 10 Intel® 955X Express Chipset Thermal/Mechanical Design Guide Figure 2-3. MCH Package Dimensions (Bottom View) NOTES: 1

Thermal Specifications R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 11 3 Thermal Specifications 3.1 Thermal Design Power (TD

Thermal Specifications R 12 Intel® 955X Express Chipset Thermal/Mechanical Design Guide

Thermal Simulation R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 13 4 Thermal Simulation Intel provides thermal simulation mod

Thermal Simulation R 14 Intel® 955X Express Chipset Thermal/Mechanical Design Guide

Thermal Metrology R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 15 5 Thermal Metrology The system designer must make temperatu

Thermal Metrology R 16 Intel® 955X Express Chipset Thermal/Mechanical Design Guide Figure 5-1. Thermal Solution Decision Flowchart Therm_Solution_

Reference Thermal Solution R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 17 6 Reference Thermal Solution Intel has developed

Reference Thermal Solution R 18 Intel® 955X Express Chipset Thermal/Mechanical Design Guide Figure 6-1. Reference Heatsink Measured Thermal Perfor

Reference Thermal Solution R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 19 Figure 6-2. Heatsink Volumetric Envelope for the

R 2 Intel® 955X Express Chipset Thermal/Mechanical Design Guide INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL

Reference Thermal Solution R 20 Intel® 955X Express Chipset Thermal/Mechanical Design Guide 6.4 Board-Level Components Keep-out Dimensions The lo

Reference Thermal Solution R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 21 Figure 6-4. Retention Mechanism Component Keep-ou

Reference Thermal Solution R 22 Intel® 955X Express Chipset Thermal/Mechanical Design Guide Figure 6-5. Plastic Wave Soldering Heatsink Assembly

Reference Thermal Solution R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 23 Figure 6-6. Plastic Wave Soldering Heatsink Extru

Reference Thermal Solution R 24 Intel® 955X Express Chipset Thermal/Mechanical Design Guide 6.5.4.1 Effect of Pressure on TIM Performance As mech

Reference Thermal Solution R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 25 6.6 Reliability Guidelines Each motherboard, heat

Reference Thermal Solution R 26 Intel® 955X Express Chipset Thermal/Mechanical Design Guide

Appendix A: Thermal Solution Component Suppliers R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 27 7 Appendix A: Thermal Soluti

Appendix A: Thermal Solution Component Suppliers R 28 Intel® 955X Express Chipset Thermal/Mechanical Design Guide Part Intel Part Number Supplier

Appendix B: Mechanical Drawings R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 29 8 Appendix B: Mechanical Drawings Table 8-1

R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 3 Contents 1 Introduction ...

Appendix B: Mechanical Drawings R 30 Intel® 955X Express Chipset Thermal/Mechanical Design Guide Figure 8-1. Plastic Wave Soldering Heatsink Assem

Appendix B: Mechanical Drawings R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 31 Figure 8-2. Plastic Wave Soldering Heatsink

Appendix B: Mechanical Drawings R 32 Intel® 955X Express Chipset Thermal/Mechanical Design Guide Figure 8-3. Plastic Wave Soldering Heatsink Drawi

Appendix B: Mechanical Drawings R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 33 Figure 8-4. Plastic Wave Soldering Heatsink

Appendix B: Mechanical Drawings R 34 Intel® 955X Express Chipset Thermal/Mechanical Design Guide Figure 8-5. Plastic Wave Soldering Heatsink Ramp

Appendix B: Mechanical Drawings R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 35 Figure 8-6. Plastic Wave Soldering Heatsink

Appendix B: Mechanical Drawings R 36 Intel® 955X Express Chipset Thermal/Mechanical Design Guide Figure 8-7. Plastic Wave Soldering Heatsink Solde

R 4 Intel® 955X Express Chipset Thermal/Mechanical Design Guide Figures Figure 2-1. MCH Package Dimensions (Top View)...

R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 5 Revision History Revision Number Description Revision Date -001 • Initial

R 6 Intel® 955X Express Chipset Thermal/Mechanical Design Guide

Introduction R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 7 1 Introduction As the complexity of computer systems increases, s

Introduction R 8 Intel® 955X Express Chipset Thermal/Mechanical Design Guide 1.1 Definition of Terms Term Description BGA Ball grid array. A pa

Packaging Technology R Intel® 955X Express Chipset Thermal/Mechanical Design Guide 9 2 Packaging Technology The 955X Express chipset consists