Intel S1155 User Manual download pdf (Page 26)

LGA1155 Socket

26 Thermal/Mechanical Specifications and Design Guidelines

All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile)

without degrading, and must be visible after the socket is mounted on the

motherboard.

LGA1155 and the manufacturer's insignia are molded or laser marked on the side wall.

3.7 Component Insertion Forces

Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/

Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table

R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force

to insert the package into the socket.

3.8 Socket Size

Socket information needed for motherboard design is given in Appendix C.

This information should be used in conjunction with the reference motherboard keep-

out drawings provided in Appendix B to ensure compatibility with the reference thermal

mechanical components.

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Intel S1155 User Manual Page 26