Intel S1155 User Manual Page 16
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- Table of contents
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Package Mechanical & Storage Specifications
16 Thermal/Mechanical Specifications and Design Guidelines
2.1.7 Processor Materials
Tab le 2-3 lists some of the package components and associated materials.
2.1.8 Processor Markings
Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Table 2-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 2-3. Processor Top-Side Markings
Sample (QDF):
GRP1LINE1: i{M}{C}YY
GRP1LINE2: INTEL CONFIDENTIAL
GRP1LINE3: QDF ES SPEED
GRP1LINE4: COUNTRY OF ORIGIN
GRP1LINE5: {FPO} {e4}
Production (SSPEC):
GRP1LINE1: i{M}{C}YY
GRP1LINE2: BRAND PROC#
GRP1LINE3: SSPEC SPEED
GRP1LINE4: COUNTRY OF ORIGIN
GRP1LINE5: {FPO} {e4}
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
S/N
- Legal Lines and Disclaime rs 2
- Contents 3
- Revision History 8
- 1 Introduction 9
- 1.1 References 10
- 1.2 Definition of Terms 10
- Introduction 12
- Specifications 13
- 37.5 14
- 2.1.7 Processor Materials 16
- 2.1.8 Processor Markings 16
- Table 2-4. Storage Conditions 18
- 3 LGA1155 Socket 19
- 3.1 Board Layout 20
- 122.6 mil (3.1144mm) 21
- 36mil (0.9144 mm) 21
- 3.2 Attachment to Motherboard 22
- 3.3 Socket Components 23
- 3.5 Durability 25
- 3.6 Markings 25
- 3.8 Socket Size 26
- 4 Independent Loading 27
- Shoulder 30
- 6-32 thread 30
- Figure 4-4. ILM Assembly 31
- Load plate not 32
- 4.5 ILM Cover 33
- Step 3: Close ILM 34
- Step 1: PnP Cover installed 34
- Step 2: Remove PnP Cover 34
- 5 LGA1155 Socket and ILM 37
- 5.3 Loading Specifications 38
- 5.4 Electrical Requirements 38
- 6 Thermal Specifications 41
- 6.1.1 Intel 43
- 6.1.2 Intel 44
- Processor E3-1200 45
- 6.1.3 Intel 46
- 6.1.4 Intel 47
- 6.1.5 Intel 48
- Graphics Thermal Profile 48
- Thermal Sensor Exceeds T 49
- 6.1.7 Thermal Metrology 54
- 6.2.1 Processor Temperature 54
- 6.2.2.1 Frequency/VID Control 55
- 6.2.2.2 Clock Modulation 56
- 6.2.2.5 PROCHOT# Signal 57
- 6.3 Intel 58
- Turbo Boost Technology 58
- 6.4 Thermal Considerations 59
- 6.4.1 Intel 60
- Reporting 60
- System Thermal Response Time 61
- Turbo Algorithm Response Time 61
- Thermal Specifications 62
- 7 PECI Interface 63
- PECI Interface 64
- 8 Sensor Based Thermal 65
- 8.2.1 TTV Thermal Profile 67
- = (TTV T 69
- ) / Power 69
- 8.5 System Validation 73
- 9 1U Thermal Solution 75
- 1U Thermal Solution 76
- CASE_MAX 77
- 9.2.2 Thermal Solution 78
- 9.2.3 Assembly 79
- 9.3 1U Reference Heatsink 80
- 9.3.3 Assembly 81
- Die Centerline 82
- Package Centerline 82
- Active Tower Thermal Solution 83
- 10.3 Electrical Requirements 85
- 10.4 Cooling Requirements 87
- Thermal Solution Quality and 89
- Reliability Requirements 89
- A Component Suppliers 93
- B Mechanical Drawings 95
- TOP SIDE 98
- BOTTOM SIDE 98
- DETAIL A 99
- Mechanical Drawings 100
- C Socket Mechanical Drawings 115
- Socket Mechanical Drawings 116
- D Package Mechanical 121
- Drawings 121
- Package Mechanical Drawings 122
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