Technologies
50 Datasheet, Volume 1
-
Datasheet – Volume 1 of 2
1
-
2 Datasheet, Volume 1
2
-
Contents
3
-
4 Datasheet, Volume 1
4
-
Datasheet, Volume 1 5
5
-
6 Datasheet, Volume 1
6
-
Datasheet, Volume 1 7
7
-
8 Datasheet, Volume 1
8
-
Revision History
9
-
10 Datasheet, Volume 1
10
-
1 Introduction
11
-
Introduction
12
-
12 Datasheet, Volume 1
12
-
1.1 Processor Feature Details
13
-
1.2 Interfaces
13
-
1.2.2 PCI Express*
14
-
Datasheet, Volume 1 15
15
-
1.2.5 Processor Graphics
16
-
1.3 Power Management Support
17
-
1.5 Package
19
-
1.6 Processor Compatibility
20
-
1.7 Terminology
21
-
1.8 Related Documents
24
-
2 Interfaces
25
-
2.1.3.1 Single-Channel Mode
27
-
Flex Memory Technology Mode
27
-
Interfaces
28
-
28 Datasheet, Volume 1
28
-
2.1.5.2 Command Overlap
29
-
2.2 PCI Express* Interface
30
-
2.2.1.1 Transaction Layer
31
-
2.2.1.2 Data Link Layer
31
-
2.2.1.3 Physical Layer
31
-
32 Datasheet, Volume 1
32
-
2.2.3 PCI Express* Graphics
33
-
2.3.1 DMI Error Flow
34
-
2.3.3 DMI Link Down
34
-
Datasheet, Volume 1 35
35
-
2.4.1.2 3D Pipeline
36
-
2.4.1.3 Video Engine
36
-
2.4.1.4 2D Engine
37
-
2.4.2.1 Display Planes
38
-
2.4.3 Intel
39
-
2.6 Interface Clocking
40
-
3 Technologies
41
-
Technologies
42
-
42 Datasheet, Volume 1
42
-
Datasheet, Volume 1 43
43
-
44 Datasheet, Volume 1
44
-
3.4 Intel
45
-
Turbo Boost Technology
45
-
3.5 Intel
46
-
3.7 Intel
47
-
64 Architecture x2APIC
47
-
48 Datasheet, Volume 1
48
-
Datasheet, Volume 1 49
49
-
50 Datasheet, Volume 1
50
-
4 Power Management
51
-
(ACPI) States Supported
52
-
4.2.1 Enhanced Intel
54
-
SpeedStep
54
-
Technology
54
-
4.2.2 Low-Power Idle States
55
-
4.2.4 Core C-states
57
-
4.2.5 Package C-States
58
-
4.2.5.1 Package C0
60
-
4.2.5.2 Package C1/C1E
60
-
4.2.5.3 Package C3 State
60
-
4.2.5.4 Package C6 State
60
-
Management
61
-
Power Management
62
-
62 Datasheet, Volume 1
62
-
Datasheet, Volume 1 63
63
-
4.5 DMI Power Management
65
-
4.6 Graphics Power Management
65
-
66 Datasheet, Volume 1
66
-
Datasheet, Volume 1 67
67
-
68 Datasheet, Volume 1
68
-
5 Thermal Management
69
-
5.2 Intel
70
-
5.3 Intel
70
-
Table 5-1. Intel
71
-
Low Power Mode (LPM)
72
-
5.4.2 Low Power Mode
73
-
5.6.1.1 TCC Activation Offset
78
-
Datasheet, Volume 1 79
79
-
Thermal Management
79
-
5.6.2 Digital Thermal Sensor
80
-
5.6.3 PROCHOT# Signal
81
-
82 Datasheet, Volume 1
82
-
5.6.4 On-Demand Mode
83
-
84 Datasheet, Volume 1
84
-
6 Signal Description
85
-
Table 6-8. Intel
89
-
Flexible Display (Intel
89
-
6.11 Power Sequencing Signals
92
-
6.12 Processor Power Signals
93
-
6.13 Sense Signals
93
-
7 Electrical Specifications
95
-
7.4 System Agent (SA) Vcc VID
99
-
7.6 Signal Groups
100
-
(Prior to Board Attach)
102
-
7.9 DC Specifications
103
-
Table 7-5. Processor Core (V
104
-
Table 7-9. Processor PLL (V
106
-
DC Specifications
110
-
Electrical Specifications
112
-
112 Datasheet, Volume 1
112
-
8 Processor Pin, Signal, and
113
-
Datasheet, Volume 1 125
125
-
126 Datasheet, Volume 1
126
-
144 Datasheet, Volume 1
144
-
Datasheet, Volume 1 145
145
-
160 Datasheet, Volume 1
160
-
Datasheet, Volume 1 161
161
-
162 Datasheet, Volume 1
162
-
Datasheet, Volume 1 163
163
-
164 Datasheet, Volume 1
164
-
Datasheet, Volume 1 165
165
-
166 Datasheet, Volume 1
166
-
Datasheet, Volume 1 167
167
-
168 Datasheet, Volume 1
168
-
9 DDR Data Swizzling
169
-
Table – Channel A
170
-
DDR Data Swizzling
172
-
172 Datasheet, Volume 1
172
Comments to this Manuals