Intel SL2YM Datasheet Page 73
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Pentium
®
II Processor at 350 MHz, 400 MHz, and 450 MHz
Datasheet 73
6.4 Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by the boxed
processor.
6.4.1 Boxed Processor Cooling Requirements
The boxed processor will be cooled with a fan heatsink. The boxed processor fan heatsink will
keep the processor temperature, within the specifications (see Section 4.0), provided airflow
through the fan heatsink is unimpeded and the air temperature entering the fan is below 45 °C (see
Figure 43 for measurement location).
Airspace is required around the fan to ensure that the airflow through the fan heatsink is not
blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan
life. Figure 43 illustrates an acceptable airspace clearance for the fan heatsink.
Figure 48. Recommended Motherboard Power Header Placement Relative to Fan Power Connector and
Pentium
®
II Processor
Table 40. Motherboard Fan Power Connector Location
Fi
g
. Ref. Labels Dimensions (Inches) Min T
yp
Max
V
Aproximate perpendicular distance of the fan power
connector from the center of the 242-contact slot connector
1.44
W
Aproximate parallel distance of the fan power connector
from the edge of the 242-contact slot connector
1.45
X
Lateral distance of the motherboard fan power header
location from the fan power connector
4.75
- II Processor at 350 MHz 1
- 400 MHz, and 450 MHz 1
- Datasheet 2
- Contents 3
- 1.0 Introduction 7
- 1.1 Terminology 8
- 1.2 References 9
- 2.0 Electrical S 10
- 2.2.1 Normal State—State 1 12
- 2.2.5 Sleep State—State 5 13
- 2.3 Power and Ground Pins 14
- 2.4 Decoupling Guidelines 14
- 2.6 Voltage Identification 15
- 2.10 Maximum Ratings 20
- 22 Datasheet 22
- Pentium 23
- Datasheet 23 23
- 26 Datasheet 26
- Datasheet 27 27
- 28 Datasheet 28
- Datasheet 29 29
- 30 Datasheet 30
- Datasheet 31 31
- 32 Datasheet 32
- Datasheet 35 35
- T37 (TRST# Pulse Width)= 36
- Measurement Guidelines 37
- Guidelines 38
- 3.3.2 Ringback Specification 41
- 4.0 Thermal S 42
- 4.1 Thermal Specifications 43
- 4.1.1 Thermal Diode 44
- Detail A Detail B 48
- (Bottom Side View) 48
- Detail C Detail D Detail E 48
- Detail A 49
- 2-D Matrix Mark 51
- See Figure 40 55
- 5.4 Pentium 58
- II Processor Signal Listing 58
- Datasheet 59 59
- 60 Datasheet 60
- 62 Datasheet 62
- Datasheet 63 63
- 6.0 Boxed Processor S 64
- 6.2 Mechanical Specifications 66
- Datasheet 67 67
- 68 Datasheet 68
- Datasheet 71 71
- 6.4 Thermal Specifications 73
- Datasheet 75 75
- 76 Datasheet 76
- Datasheet 77 77
- 78 Datasheet 78
- Datasheet 79 79
- 80 Datasheet 80
- 7.2 Signal Summaries 81
- 82 Datasheet 82
- Table 43. Input Signals 82
- Datasheet 83 83
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