Intel SL2YM Datasheet download pdf (Page 6)

Pentium

Processor at 350 MHz, 400 MHz, and 450 MHz

6 Datasheet

7 Non-AGTL+ Signal Group DC Specifications......................................................24

8 AGTL+ Bus Specifications .................................................................................25

9 System Bus AC Specifications (Clock) at the Processor Edge Fingers .............26

10 System Bus AC Specifications (Clock) at Processor Core Pins ........................27

11 Valid System Bus, Core Frequency, and Cache Bus Frequencies ....................27

12 System Bus AC Specifications (AGTL+ Signal Group)at the Processor

Edge Fingers ......................................................................................................28

13 System Bus AC Specifications (AGTL+ Signal Group) at the Processor

Core Pins ...........................................................................................................28

14 System Bus AC Specifications (CMOS Signal Group) at the Processor

Edge Fingers 29

15 System Bus AC Specifications (CMOS Signal Group)at the Processor Core

Pins 29

16 System Bus AC Specifications (Reset Conditions) ............................................30

17 System Bus AC Specifications (APIC Clock and APIC I/O) at the Processor

Edge Fingers.......................................................................................................30

18 System Bus AC Specifications (APIC Clock and APIC I/O)at the Processor

Core Pins ...........................................................................................................31

19 System Bus AC Specifications (TAP Connection)at the Processor Edge

Fingers ...............................................................................................................31

20 System Bus AC Specifications (TAP Connection)at the Processor Core Pins ..32

21 BCLK Signal Quality Specifications for Simulation at the Processor Core ........37

22 BCLK Signal Quality Guidelines for Edge Finger Measurement ........................38

23 AGTL+ Signal Groups Ringback Tolerance Specifications at the Processor

Core ...................................................................................................................39

24 AGTL+ Signal Groups Ringback Tolerance Guidelines for Edge Finger

Measurement .....................................................................................................39

25 Signal Ringback Specifications for Non-AGTL+ Signal Simulation at the

Processor Core ..................................................................................................41

26 Signal Ringback Guidelines for Non-AGTL+ Signal Edge Finger Measurement 41

27 Thermal Specifications for S.E.C.C. Packaged Processors ...............................43

28 Thermal Specifications for S.E.C.C.2 Packaged Processors..............................43

29 Thermal Diode Parameters.................................................................................44

30 Thermal Diode Interface......................................................................................44

31 Description Table for Processor Markings (S.E.C.C. Packaged Processor).......52

32 Description Table for Processor Markings (S.E.C.C.2 Packaged Processor).....57

33 S.E.C.C. Materials ..............................................................................................57

34 S.E.C.C.2 Materials ............................................................................................57

35 Signal Listing in Order by Pin Number ................................................................58

36 Signal Listing in Order by Signal Name ..............................................................61

37 Boxed Processor Fan Heatsink Spatial Dimensions...........................................69

38 Boxed Processor Fan Heatsink Support Dimensions .........................................70

39 Fan Heatsink Power and Signal Specifications...................................................72

40 Motherboard Fan Power Connector Location .....................................................73

41 Signal Description ...............................................................................................74

42 Output Signals.....................................................................................................81

43 Input Signals .......................................................................................................82

44 Input/Output Signals (Single Driver)....................................................................83

45 Input/Output Signals (Multiple Driver) .................................................................83

1 2 3 4 5 6 7 8 9 10 11 ... 83 84

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Intel SL2YM Datasheet Page 6

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