Intel SL2YM Datasheet download pdf (Page 43)

Pentium

II Processor at 350 MHz, 400 MHz, and 450 MHz

Datasheet 43

4.1 Thermal Specifications

Table 27 and Table 28 provide the thermal design power dissipation and maximum and minimum

temperatures for Pentium II processors with S.E.C.C. and S.E.C.C.2 package technologies,

respectively. While the processor core dissipates the majority of the thermal power, thermal power

dissipated by the L2 cache also impacts the overall processor power specification. Systems should

design for the highest possible thermal power, even if a processor with a lower thermal dissipation

is planned.

NOTES:

1. These values are specified at nominal V

CORE

for the processor core and nominal V

CCL2

for the L2 cache.

2. Processor power includes the power dissipated by the processor core, the L2 cache, and the AGTL + bus termination.

The maximum power for each of these components does not occur simultaneously.

3. Extended Thermal Plate power is the processor power that is dissipated through the extended thermal plate.

4. These processors use the extended thermal plate for the Pentium

II processor (see Figure 17).

Table 28. Thermal Specifications for S.E.C.C.2 Packaged Processors

NOTES:

1. These values are specified at nominal V

CORE

for the processor core and nominal V

CCL2

for the L2 cache.

2. Processor power includes the power dissipated by the processor core, the L2 cache, and the AGTL + bus termination.

The maximum power for each of these components does not occur simultaneously.

For S.E.C.C. packaged processors, the extended thermal plate is the attach location for all thermal

solutions. The maximum and minimum extended thermal plate temperatures are specified in Table

27. For S.E.C.C.2 packaged processors, thermal solutions attach to the processor by connecting

through the substrate to the cover. The maximum and minimum temperatures of the pertinent

locations are specified in Table 28. A thermal solution should be designed to ensure the

temperature of the specified locations never exceeds these temperatures.

The total processor power is a result of heat dissipation that is a combination of heat from both the

processor core and L2 cache. The overall system chassis thermal design must comprehend the

entire processor power. In S.E.C.C. packaged processors, the extended thermal plate power is a

component of this power, and is composed of a combination of the processor core and the L2 cache

dissipating heat through the extended thermal plate. The heatsink need only be designed to

dissipate the extended thermal plate power. See Table 27 for current Pentium II processor thermal

design specifications.

Table 27. Thermal Specifications for S.E.C.C. Packaged Processors

Processor Core

Fre

uenc

(MHz)

L2 Cache

Size

(Kb

tes)

Processor

Power

(W)

Extended

Thermal Plate

Power

(W)

Min

PLATE

(°C)

Max

PLATE

(°C)

Min

COVER

(°C)

Max

COVER

(°C)

450

512 27.1 26.4 5 70 5 75

400

512 24.3 23.6 5 75 5 75

350

512 21.5 20.8 5 75 5 75

Processor

Core

Fre

uenc

(MHz)

L2 Cache

Size

(Kb

tes)

Processor

Power

(W)

Min

PLGA

CASE

(°C)

Max

PLGA

CASE

(°C)

Min

OLGA

JUNC

(°C)

Max

OLGA

JUNC

(°C)

L2 Cache

Min T

CASE

(°C)

L2 Cache

Max T

CASE

(°C)

Min

COVER

(°C)

Max

COVER

(°C)

450 512 27.1 N/A N/A 5 90 5 105 5 75

400 512 24.3 N/A N/A 5 90 5 105 5 75

350 512 21.5 5 80 N/A N/A 5 105 5 75

1 2 ... 38 39 40 41 42 43 44 45 46 47 48 ... 83 84

Comments to this Manuals

No comments

Intel SL2YM Datasheet Page 43

Comments to this Manuals

Related products and manuals for Processors Intel SL2YM