Intel BX80569QX6850 Datasheet download pdf (Page 42)

Package Mechanical Specifications

42 Datasheet

3.1.4 Package Insertion Specifications

The processor can be inserted into and removed from a LGA775 socket 15 times. The

socket should meet the LGA775 requirements detailed in the LGA775 Socket

Mechanical Design Guide.

3.1.5 Processor Mass Specification

The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all

the components that are included in the package.

3.1.6 Processor Materials

Table 23 lists some of the package components and associated materials.

3.1.7 Processor Markings

Figure 12 through Figure 16show the topside markings on the processor. The diagrams

are to aid in the identification of the processor.

Table 23. Processor Materials

Component Material

Integrated Heat Spreader (IHS) Nickel Plated Copper

Substrate Fiber Reinforced Resin

Substrate Lands Gold Plated Copper

Figure 12. Processor Top-Side Markings Example for the Intel

Core™2 Duo Desktop

Processor E6000 Sequence with 4 MB L2 Cache with 1333 MHz FSB

ATPO

S/N

INTEL® CORE™2 DUO

SLxxx [COO]

3.00GHZ/4M/1333/06

[FPO]

1 2 ... 37 38 39 40 41 42 43 44 45 46 47 ... 121 122

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Intel BX80569QX6850 Datasheet Page 42