Intel BX80569QX6850 Datasheet download pdf (Page 3)

Datasheet 3

Contents

1Introduction............................................................................................................11

1.1 Terminology .....................................................................................................12

1.1.1 Processor Terminology............................................................................12

1.2 References .......................................................................................................14

2 Electrical Specifications...........................................................................................15

2.1 Power and Ground Lands....................................................................................15

2.2 Decoupling Guidelines........................................................................................15

2.2.1 VCC Decoupling .....................................................................................15

2.2.2 Vtt Decoupling.......................................................................................15

2.2.3 FSB Decoupling......................................................................................16

2.3 Voltage Identification.........................................................................................16

2.4 Market Segment Identification (MSID) .................................................................18

2.5 Reserved, Unused, and TESTHI Signals ................................................................18

2.6 Voltage and Current Specification........................................................................19

2.6.1 Absolute Maximum and Minimum Ratings ..................................................19

2.6.2 DC Voltage and Current Specification........................................................20

2.6.3 V

Overshoot .......................................................................................25

2.6.4 Die Voltage Validation.............................................................................26

2.7 Signaling Specifications......................................................................................26

2.7.1 FSB Signal Groups..................................................................................27

2.7.2 CMOS and Open Drain Signals .................................................................28

2.7.3 Processor DC Specifications .....................................................................29

2.7.3.1 GTL+ Front Side Bus Specifications .............................................30

2.7.4 Clock Specifications................................................................................31

2.7.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking............................31

2.7.6 FSB Frequency Select Signals (BSEL[2:0]).................................................31

2.7.7 Phase Lock Loop (PLL) and Filter ..............................................................32

2.7.8 BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 32

2.7.9 BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 34

2.8 PECI DC Specifications.......................................................................................35

3 Package Mechanical Specifications ..........................................................................37

3.1 Package Mechanical Drawing...............................................................................37

3.1.1 Processor Component Keep-Out Zones......................................................41

3.1.2 Package Loading Specifications ................................................................41

3.1.3 Package Handling Guidelines....................................................................41

3.1.4 Package Insertion Specifications...............................................................42

3.1.5 Processor Mass Specification....................................................................42

3.1.6 Processor Materials.................................................................................42

3.1.7 Processor Markings.................................................................................42

3.1.8 Processor Land Coordinates.....................................................................45

4 Land Listing and Signal Descriptions .......................................................................47

4.1 Processor Land Assignments...............................................................................47

4.2 Alphabetical Signals Reference............................................................................70

5 Thermal Specifications and Design Considerations ..................................................79

5.1 Processor Thermal Specifications.........................................................................79

5.1.1 Thermal Specifications............................................................................79

5.1.2 Thermal Metrology .................................................................................86

5.2 Processor Thermal Features................................................................................86

5.2.1 Thermal Monitor.....................................................................................86

5.2.2 Thermal Monitor 2..................................................................................87

5.2.3 On-Demand Mode ..................................................................................88

5.2.4 PROCHOT# Signal..................................................................................89

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Intel BX80569QX6850 Datasheet Page 3

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