Intel BX80569QX6850 Datasheet download pdf (Page 4)

4 Datasheet

5.2.5 THERMTRIP# Signal................................................................................89

5.3 Thermal Diode...................................................................................................90

5.4 Platform Environment Control Interface (PECI) ......................................................92

5.4.1 Introduction...........................................................................................92

5.4.1.1 Key Difference with Legacy Diode-Based Thermal Management .......92

5.4.2 PECI Specifications .................................................................................94

5.4.2.1 PECI Device Address..................................................................94

5.4.2.2 PECI Command Support.............................................................94

5.4.2.3 PECI Fault Handling Requirements...............................................94

5.4.2.4 PECI GetTemp0() Error Code Support ..........................................94

6Features..................................................................................................................95

6.1 Power-On Configuration Options ..........................................................................95

6.2 Clock Control and Low Power States.....................................................................95

6.2.1 Normal State .........................................................................................96

6.2.2 HALT and Extended HALT Powerdown States..............................................96

6.2.2.1 HALT Powerdown State ..............................................................96

6.2.2.2 Extended HALT Powerdown State ................................................97

6.2.3 Stop Grant and Extended Stop Grant States...............................................97

6.2.3.1 Stop Grant State.......................................................................97

6.2.3.2 Extended Stop Grant State.........................................................98

6.2.4 Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop

State, and Stop Grant Snoop State ...........................................................98

6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................98

6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State.......98

6.3 Enhanced Intel

SpeedStep

Technology .............................................................98

7 Boxed Processor Specifications..............................................................................101

7.1 Mechanical Specifications..................................................................................102

7.1.1 Boxed Processor Cooling Solution Dimensions...........................................102

7.1.2 Boxed Processor Fan Heatsink Weight .....................................................103

7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip

Assembly.............................................................................................103

7.2 Electrical Requirements ....................................................................................103

7.2.1 Fan Heatsink Power Supply ....................................................................103

7.3 Thermal Specifications......................................................................................105

7.3.1 Boxed Processor Cooling Requirements....................................................105

7.3.2 Fan Speed Control Operation (Intel

Core2 Extreme Processor

X6800 Only) ........................................................................................107

7.3.3 Fan Speed Control Operation (Intel

Core2 Duo Desktop Processor

E6000 and E4000 Sequences Only).........................................................107

8 Balanced Technology Extended (BTX) Boxed Processor Specifications...................111

8.1 Mechanical Specifications..................................................................................112

8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor

Cooling Solution Dimensions ..................................................................112

8.1.2 Boxed Processor Thermal Module Assembly Weight ...................................114

8.1.3 Boxed Processor Support and Retention Module (SRM) ..............................115

8.2 Electrical Requirements ....................................................................................116

8.2.1 Thermal Module Assembly Power Supply..................................................116

8.3 Thermal Specifications......................................................................................118

8.3.1 Boxed Processor Cooling Requirements....................................................118

8.3.2 Variable Speed Fan...............................................................................118

9 Debug Tools Specifications ....................................................................................121

9.1 Logic Analyzer Interface (LAI) ...........................................................................121

9.1.1 Mechanical Considerations .....................................................................121

9.1.2 Electrical Considerations........................................................................121

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Intel BX80569QX6850 Datasheet Page 4

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