Intel BX80569QX6850 Datasheet download pdf (Page 111)

Datasheet 111

Balanced Technology Extended (BTX) Boxed Processor Specifications

8 Balanced Technology Extended

(BTX) Boxed Processor

Specifications

The processor is offered as an Intel boxed processor. Intel boxed processors are

intended for system integrators who build systems from largely standard components.

The boxed processor will be supplied with a cooling solution known as the Thermal

Module Assembly (TMA). Each processor will be supplied with one of the two available

types of TMAs – Type I or Type II. This chapter documents motherboard and system

requirements for both the TMAs that will be supplied with the boxed processor in the

775-land LGA package. This chapter is particularly important for OEMs that

manufacture motherboards for system integrators. Figure 40 shows a mechanical

representation of a boxed processor in the 775-land LGA package with a Type I TMA.

Figure 41 illustrates a mechanical representation of a boxed processor in the 775-land

LGA package with Type II TMA.

Note: Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and

inches [in brackets].

Note: Drawings in this section reflect only the specifications on the Intel boxed processor

product. These dimensions should not be used as a generic keep-out zone for all

cooling solutions. It is the system designers’ responsibility to consider their proprietary

cooling solution when designing to the required keep-out zone on their system

platforms and chassis. Refer to the appropriate Thermal and Mechanical Design

Guidelines (see Section 1.2) for further guidance.

NOTE: The duct, clip, heatsink and fan can differ from this drawing representation but

the basic shape and size will remain the same.

Figure 40. Mechanical Representation of the Boxed Processor with a Type I TMA

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Intel BX80569QX6850 Datasheet Page 111