Intel B80532PG0962M Datasheet download pdf (Page 80)

80 Intel

Pentium

4 Processor on 0.13 Micron Process Datasheet

Boxed Processor Specifications

The target load applied by the clips to the processor heat spreader for Intel’s reference design is

75 ± 15 lbf (maximum load is constrained by the package load capability). It is normal to observe a

bow or bend in the board due to this compressive load on the processor package and the socket.

The level of bow or bend depends on the motherboard material properties and component layout.

Any additional board stiffening devices such as plates are not necessary and should not be used

along with the reference mechanical components and boxed processor. Using such devices increase

the compressive load on the processor package and socket, likely beyond the maximum load that is

specified for those components. Refer to the Intel

Pentium

4 Processor with 512-KB L2 Cache

on 0.13 Micron Process Thermal Design Guidelines for details on the Intel reference design.

7.3 Electrical Requirements

7.3.1 Fan Heatsink Power Supply

The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be

shipped with the boxed processor to draw power from a power header on the motherboard. The

power cable connector and pinout are shown in Figure 7-4. Motherboards must provide a matched

power header to support the boxed processor. Table 7-1 contains specifications for the input and

output signals at the fan heatsink connector. The fan heatsink outputs a SENSE signal, which is an

open-collector output that pulses at a rate of two pulses per fan revolution. A motherboard pull-up

resistor provides V

to match the system board-mounted fan speed monitor requirements, if

applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the

connector should be tied to GND.

Note: The motherboard must supply a constant +12 V to the processor’s power header to ensure proper

operation of the variable speed fan for the boxed processor.

The power header on the baseboard must be positioned to allow the fan heatsink power cable to

reach it. The power header identification and location should be documented in the platform

documentation, or on the system board itself. Figure 7-5 shows the location of the fan power

connector relative to the processor socket. The motherboard power header should be positioned

within 4.33 inches from the center of the processor socket.

Figure 7-4. Boxed Processor Fan Heatsink Power Cable Connector Description

Pin Signal

Straight square pin, 3-pin terminal housing with

polarizing ribs and friction locking ramp.

0.100" pin pitch, 0.025" square pin width.

Waldom*/Molex* P/N 22-01-3037 or equivalent.

Match with straight pin, friction lock header on motherboard

Waldom/Molex P/N 22-23-2031, AMP* P/N 640456-3,

or equivalent.

GND

+12V

SENSE

123

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Intel B80532PG0962M Datasheet Page 80

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