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10 Intel
®
Pentium
®
4 Processor on 0.13 Micron Process Datasheet
Introduction
Additional features within the Intel NetBurst microarchitecture include advanced dynamic
execution, advanced transfer cache, enhanced floating point and multi-media unit, and Streaming
SIMD Extensions 2 (SSE2). The advanced dynamic execution improves speculative execution and
branch prediction internal to the processor. The advanced transfer cache is a 512-KB, on-die level 2
(L2) cache. A new floating point and multi-media unit has been implemented that provides
superior performance for multi-media and mathematically intensive applications. Finally, SSE2
adds 144 new instructions for double-precision floating point, SIMD integer, and memory
management. Power management capabilities (such as AutoHALT, Stop-Grant, and Sleep) have
been retained.
The Streaming SIMD Extensions 2 (SSE2) enable break-through levels of performance in multi-
media applications including 3-D graphics, video decoding/encoding, and speech recognition. The
new packed double-precision floating-point instructions enhance performance for applications that
require greater range and precision, including scientific and engineering applications and advanced
3-D geometry techniques (such as ray tracing).
The 2-MB L3 cache is available with only the Pentium 4 processor Extreme Edition. The
additional third level of cache is located on the processor die and is designed specifically to meet
the compute needs of high-end gamers and other power users. The integrated level 3 cache is
available in 2-MB and is coupled with the 800 MHz system bus to provide a high bandwidth path
to memory. The efficient design of the integrated Level 3 cache provides a faster path to large data
sets stored in cache on the processor. This results in reduced average memory latency and increased
throughput for larger workloads.
The Intel NetBurst microarchitecture system bus on the Pentium 4 processor on 0.13 micron
process uses a split-transaction, deferred reply protocol like the Pentium 4 processor in the 478-pin
package. This system bus is not compatible with the P6 processor family bus. The Intel NetBurst
microarchitecture system bus uses Source-Synchronous Transfer (SST) of address and data to
improve performance by transferring data four times per bus clock (4X data transfer rate, as in
AGP 4X). Along with the 4X data bus, the address bus can deliver addresses two times per bus
clock and is referred to as a “double-clocked” or 2X address bus. Working together, the 4X data
bus and 2X address bus provide a data bus bandwidth of up to 6.4 Gbytes/second.
Intel will enable support components for the Pentium 4 processor on 0.13 micron process including
heatsinks, heatsink retention mechanisms, and sockets. Manufacturability is a high priority; hence,
mechanical assembly can be completed from the top of the motherboard, and should not require
any special tooling.
The processor system bus uses a variant of GTL+ signalling technology called Assisted Gunning
Transceiver Logic (AGTL+) signal technology.
- Datasheet 1
- Technology 1
- 2 Intel 2
- Contents 3
- Revision History 7
- Introduction 1 9
- 10 Intel 10
- 1.1 Terminology 11
- 1.2 References 12
- Introduction 13
- Electrical Specifications 2 15
- 2.3 Decoupling Guidelines 16
- 2.4 Voltage Identification 16
- 18 Intel 18
- 20 Intel 20
- 2.6 System Bus Signal Groups 21
- 2.7 Asynchronous GTL+ Signals 22
- 2.10 Maximum Ratings 23
- Electrical Specifications 24
- 28 Intel 28
- 30 Intel 30
- 36 Intel 36
- 35mm square 37
- 478 pins 37
- Code Letter 38
- Dimension (mm) 38
- Min Nominal Max 38
- 40 Intel 40
- 3.4 Processor Materials 41
- 3.5 Processor Markings 42
- 44 Intel 44
- 4.1 Processor Pin Assignments 45
- 46 Intel 46
- IMPSEL AE26 Power/Other Input 47
- 48 Intel 48
- 50 Intel 50
- 52 Intel 52
- 54 Intel 54
- 56 Intel 56
- 4.2 Signal Descriptions 58
- Name Type Description 59
- 60 Intel 60
- Signals Associated Strobe 61
- °C. Upon assertion of 65
- 66 Intel 66
- Considerations 5 67
- 68 Intel 68
- 5.1.1 Thermal Specifications 68
- 5.1.2 Thermal Metrology 70
- Features 6 71
- 72 Intel 72
- 6.3 Thermal Monitor 74
- 6.3.1 Thermal Diode 76
- 7.1 Introduction 77
- 7.2 Mechanical Specifications 78
- Assembly 79
- 7.3 Electrical Requirements 80
- with a resistor 81
- IC: Fan current draw 740 mA 81
- 7.4 Thermal Specifications 82
- 7.4.2 Variable Speed Fan 83
- 84 Intel 84
- Debug Tools Specifications 8 85
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