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Intel® Server Boards S5520HC and S5500HCV TPS Design and Environmental Specifications
Revision 1.2
Intel order number E39529-009
127
9. Design and Environmental Specifications
9.1 Intel
®
Server Boards S5520HC and S5500HCV Design
Specifications
Operation of the Intel
®
Server Boards S5520HC and/or S5500HCV at conditions beyond those
shown in the following table may cause permanent damage to the system. Exposure to absolute
maximum rating conditions for extended periods may affect system reliability.
Table 70. Server Board Design Specifications
Operating Temperature
0º C to 55º C 1 (32º F to 131º F)
Non-Operating Temperature
-40º C to 70º C (-40º F to 158º F)
DC Voltage
± 5% of all nominal voltages
Shock (Unpackaged)
Trapezoidal, 50 G, 170 inches / sec
Shock (Packaged)
< 20 pounds
20 to < 40 pounds
40 to < 80 pounds
80 to < 100 pounds
100 to < 120 pounds
120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged)
5 Hz to 500 Hz 3.13 g RMS random
Note:
1
Chassis design must provide proper airflow to avoid exceeding the processor maximum case
temperature.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel ensures through its own
chassis development and testing that when Intel
®
server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel
®
developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount
of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of its published operating or non-operating limits.
9.2 MTBF
The following is the calculated Mean Time Between Failures (MTBF) 30 C (ambient air). These
values are derived using a historical failure rate and multiplied by factors for application,
electrical and/or thermal stress and for device maturity. You should view MTBF estimates as
“reference numbers” only.
Calculation Model: Telcordia Issue 1, method I case 3
Operating Temperature: Server in 30° C ambient air
- Server Boards S5520HC and 1
- S5500HCV 1
- Revision History 2
- Disclaimers 3
- Table of Contents 4
- List of Figures 9
- Revision 1.2 10
- List of Tables 11
- 1. Introduction 15
- 2. Overview 16
- Server Board Layout 19
- 3. Functional Architecture 31
- 3.1 Intel 34
- 5520 and 5500 I/O Hub (IOH) 34
- 3.1.5 Controller Link (CL) 35
- 3.2 Processor Support 36
- Revision 1.2 38
- 3.3 Memory Subsystem 40
- 3.3.2 Supported Memory 42
- Configuration 43
- 3.3.5 Memory Interleaving 46
- 3.3.6 Memory Test 47
- 3.3.7 Memory Scrub Engine 47
- 3.3.8 Memory RAS 47
- 3.4 ICH10R 53
- 3.4.2 USB 2.0 Support 56
- 3.5 PCI Subsystem 57
- 3.6 Intel 60
- Accessory) 60
- 3.6.1 SAS RAID Support 61
- 3.8 Serial Ports 65
- 3.9 Floppy Disk Controller 65
- 3.11 Video Support 65
- 3.11.1 Video Modes 66
- 3.11.2 Dual Video 66
- 3.13 ACPI Support 68
- 3.14 Intel 68
- Virtualization Technology 68
- 3.15 Intel 68
- I/O Acceleration Technology 68
- 4. Platform Management 69
- 4.2.3 Media Redirection 72
- 4.2.5 Embedded Web server 74
- 4.3 Platform Control 75
- 4.3.2 Fan Speed Control 76
- Fan Domain 1 System Fan 5 77
- 4.4 Intel 79
- 5. BIOS Setup Utility 81
- 5.3.1 Operation 82
- 5.3.2.1 Main Screen 85
- 5.3.2.2.2 Memory Screen 91
- 5.3.2.2.6 PCI Screen 99
- Revision 1.2 103
- Redirection 105
- Information 107
- 6.2 Power Connectors 120
- 6.3.2 LCP / IPMB Header 122
- 6.3.1 Intel 122
- 6.4 Front Panel Connector 123
- 6.5 I/O Connectors 124
- 6.5.3 SATA Connectors 126
- 6.5.4 SAS Module Slot 126
- 6.5.5 Serial Port Connectors 127
- 6.5.6 USB Connector 127
- 6.6 Fan Headers 129
- 7. Jumper Blocks 131
- 7.1.1 Clearing the CMOS 132
- 7.1.2 Clearing the Password 132
- 7.3 BIOS Recovery Jumper 133
- 8. Intel 135
- Light Guided Diagnostics 135
- 8.2 Fan Fault LED’s 136
- A. System ID LED 137
- B. System Status LED 137
- 8.4 DIMM Fault LEDs 139
- 9.1 Intel 141
- Specifications 141
- 9.2 MTBF 141
- Table 71. MTBF Estimate 142
- 9.4.1 Grounding 145
- 9.4.2 Stand-by Outputs 145
- 9.4.3 Remote Sense 145
- 9.4.4 Voltage Regulation 146
- 9.4.5 Dynamic Loading 146
- 9.4.6 Capacitive Loading 147
- 9.4.7 Ripple / Noise 147
- 9.4.8 Timing Requirements 147
- FCC (USA) 153
- ICES-003 (Canada) 155
- VCCI (Japan) 155
- BSMI (Taiwan) 155
- RRL KCC (Korea) 156
- CNCA (CCC-China) 156
- 10.7 CA Perchlorate Warning 159
- Appendix B: Compatible Intel 162
- Server Chassis 162
- POST Error Beep Codes 185
- Glossary 188
- Reference Documents 192
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