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Electrical Specifications
84 Datasheet, Volume 1
7.10 DC Specifications
The processor DC specifications in this section are defined at the processor
pads, unless noted otherwise. See Chapter 8 for the processor land listings and
Chapter 6 for signal definitions. Voltage and current specifications are detailed in
Table 7-4, Table 7-5, and Table 7-6.
The DC specifications for the DDR3 signals are listed in Table 7-7 Control Sideband and
Test Access Port (TAP) are listed in Table 7-8.
Table 7-4 through Table 7-6 list the DC specifications for the processor and are valid
only while meeting the thermal specifications (as specified in the Thermal / Mechanical
Specifications and Guidelines), clock frequency, and input voltages. Care should be
taken to read all notes associated with each parameter.
7.10.1 Voltage and Current Specifications
Note: Noise measurements on SENSE lands for all voltage supplies should be made with a
20-MHz bandwidth oscilloscope.
Table 7-4. Processor Core Active and Idle Mode DC Voltage and Current Specifications
(Sheet 1 of 2)
Symbol Parameter Min Typ Max Unit Note
VID VID Range 0.2500 — 1.5200 V 1
LL
VCC
V
CC
Loadline Slope
2011D, 2011C, 2011B (processors with
77 W, 65 W, 55 W, 45 W TDP)
1.7 mΩ 2, 4, 5
V
CC
TOB
V
CC
Tolerance Band
2011D, 2011C, 2011B (processors with
77 W, 65 W, 55 W, 45 W TDP)
PS0
PS1
PS2
±16
±13
±11.5
mV
2, 4, 5,
6
V
CC
Ripple
Ripple:
2011D, 2011C, 2011B (processors with
77 W, 65 W, 55 W, 45 W TDP)
PS0
PS1
PS2
±7
±10
-10/+25
mV
2, 4, 5,
6
LL
VCC
V
CC
Loadline Slope 2011A (processors
with 35 W TDP)
2.9 mΩ
2, 4, 5,
7
V
CC
TOB
V
CC
Tolerance Band
2011A (processors with 35 W TDP)
PS0
PS1
PS2
±19
±19
±11.5
mV
2, 4, 5,
6, 7
V
CC
Ripple
Ripple:
2011A (processors with 35 W TDP)
PS0
PS1
PS2
±10
±10
-10/+25
mV
2, 4, 5,
6, 7
V
CC,BOOT
Default V
CC
voltage for initial power up — 0 — V
I
CC
2011D I
CC
(processors with 77 W, TDP) — — 112 A 3
I
CC
2011C I
CC
(processors with 55 W TDP) — — 75 A 3
- Datasheet – Volume 1 of 2 1
- Contents 3
- Datasheet, Volume 1 4
- Datasheet, Volume 1 5 5
- Datasheet, Volume 1 7 7
- Revision History 8
- 1 Introduction 9
- Processor 10
- 1.1 Processor Feature Details 11
- 1.2 Interfaces 11
- 1.2.2 PCI Express* 12
- Datasheet, Volume 1 31 13
- Introduction 13
- 1.2.5 Processor Graphics 14
- 1.3 Power Management Support 15
- 1.4 Processor SKU Definitions 16
- 1.5 Package 17
- 1.6 Processor Compatibility 18
- 1.7 Terminology 19
- 1.8 Related Documents 22
- 2 Interfaces 23
- 2.1.3.1 Single-Channel Mode 25
- Flex Memory Technology Mode 25
- Interfaces 26
- 26 Datasheet, Volume 1 26
- 2.1.5.2 Command Overlap 27
- 2.2 PCI Express* Interface 28
- 2.2.1.1 Transaction Layer 29
- 2.2.1.2 Data Link Layer 29
- 2.2.1.3 Physical Layer 29
- 30 Datasheet, Volume 1 30
- 2.2.3 PCI Express* Port 31
- 2.3.1 DMI Error Flow 32
- 2.3.3 DMI Link Down 32
- Datasheet, Volume 1 33 33
- 2.4.1.2 3D Pipeline 34
- 2.4.1.3 Video Engine 34
- 2.4.1.4 2D Engine 35
- 2.4.2.1 Display Planes 36
- 2.4.2.2 Display Pipes 37
- 2.4.2.3 Display Ports 37
- 2.6 Interface Clocking 38
- 3 Technologies 39
- Technologies 40
- 40 Datasheet, Volume 1 40
- Datasheet, Volume 1 41 41
- 42 Datasheet, Volume 1 42
- 3.4 Intel 43
- Turbo Boost Technology 43
- 3.5 Intel 44
- 3.7 Intel 45
- 64 Architecture x2APIC 45
- 46 Datasheet, Volume 1 46
- 4 Power Management 47
- (ACPI) States Supported 48
- 4.2.1 Enhanced Intel 50
- SpeedStep 50
- Technology 50
- 4.2.2 Low-Power Idle States 50
- C1 C1E C6C3 51
- 4.2.4.1 Core C0 State 52
- 4.2.4.2 Core C1 / C1E State 53
- 4.2.4.3 Core C3 State 53
- 4.2.4.4 Core C6 State 53
- 4.2.4.5 C-State Auto-Demotion 53
- 4.2.5 Package C-States 54
- 4.2.5.1 Package C0 55
- 4.2.5.2 Package C1/C1E 55
- 4.2.5.3 Package C3 State 56
- 4.2.5.4 Package C6 State 56
- Management 56
- Datasheet, Volume 1 57 57
- Power Management 57
- 58 Datasheet, Volume 1 58
- Datasheet, Volume 1 59 59
- 4.5 DMI Power Management 60
- 4.6 Graphics Power Management 60
- 4.6.4 Intel 61
- 4.6.5 Intel 61
- Graphics Dynamic Frequency 61
- 62 Datasheet, Volume 1 62
- 5 Thermal Management 63
- Thermal Management 64
- 64 Datasheet, Volume 1 64
- 6 Signal Description 65
- 6.5 Intel 69
- Flexible Display (Intel 69
- FDI) Interface 69
- 6.10 Power Sequencing Signals 72
- 6.11 Processor Power Signals 73
- 6.12 Sense Signals 73
- 7 Electrical Specifications 75
- Voltage Identification (VID) 76
- 7.7 Signal Groups 80
- 7.5 System Agent (SA) V 80
- 7.10 DC Specifications 84
- (Sheet 2 of 2) 85
- Specifications 86
- DC Specifications 90
- Electrical Specifications 92
- 92 Datasheet, Volume 1 92
- 8 Processor Land and Signal 93
- 94 Datasheet, Volume 1 94
- Land Name 100
- 108 Datasheet, Volume 1 108
- 9 DDR Data Swizzling 109
- Table – Channel A 110
- 112 Datasheet, Volume 1 112
- DDR Data Swizzling 112
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