Intel BX80623I72600K Datasheet Page 5
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Datasheet, Volume 1 5
4.3.2.1 Initialization Role of CKE............................................................ 54
4.3.2.2 Conditional Self-Refresh ............................................................ 54
4.3.2.3 Dynamic Power-down Operation ................................................. 54
4.3.2.4 DRAM I/O Power Management .................................................... 54
4.4 PCIe* Power Management .................................................................................. 54
4.5 DMI Power Management..................................................................................... 55
4.6 Graphics Power Management .............................................................................. 55
4.6.1 Intel® Rapid Memory Power Management (RMPM) (also know as CxSR) ........ 55
4.6.2 Intel® Graphics Performance Modulation Technology(GPMT) ........................ 55
4.6.3 Graphics Render C-State ......................................................................... 55
4.6.4 Intel
®
Smart 2D Display Technology (Intel
®
S2DDT) .................................. 55
4.6.5 Intel
®
Graphics Dynamic Frequency.......................................................... 56
4.7 Thermal Power Management............................................................................... 56
5 Thermal Management.............................................................................................. 57
6 Signal Description ................................................................................................... 59
6.1 System Memory Interface .................................................................................. 60
6.2 Memory Reference and Compensation.................................................................. 61
6.3 Reset and Miscellaneous Signals.......................................................................... 62
6.4 PCI Express* Based Interface Signals................................................................... 63
6.5 Intel
®
Flexible Display Interface Signals ............................................................... 63
6.6 DMI................................................................................................................. 64
6.7 PLL Signals....................................................................................................... 64
6.8 TAP Signals ...................................................................................................... 64
6.9 Error and Thermal Protection .............................................................................. 65
6.10 Power Sequencing ............................................................................................. 65
6.11 Processor Power Signals..................................................................................... 66
6.12 Sense Pins ....................................................................................................... 66
6.13 Ground and NCTF .............................................................................................. 66
6.14 Processor Internal Pull Up/Pull Down.................................................................... 67
7 Electrical Specifications........................................................................................... 69
7.1 Power and Ground Lands.................................................................................... 69
7.2 Decoupling Guidelines........................................................................................ 69
7.2.1 Voltage Rail Decoupling........................................................................... 69
7.3 Processor Clocking (BCLK[0], BCLK#[0]).............................................................. 70
7.3.1 PLL Power Supply................................................................................... 70
7.4 V
CC
Voltage Identification (VID) .......................................................................... 70
7.5 System Agent (SA) VCC VID ............................................................................... 74
7.6 Reserved or Unused Signals................................................................................ 74
7.7 Signal Groups ................................................................................................... 75
7.8 Test Access Port (TAP) Connection....................................................................... 76
7.9 Storage Conditions Specifications ........................................................................ 77
7.10 DC Specifications .............................................................................................. 78
7.10.1 Voltage and Current Specifications............................................................ 78
7.11 Platform Environmental Control Interface (PECI) DC Specifications........................... 84
7.11.1 PECI Bus Architecture ............................................................................. 84
7.11.2 DC Characteristics .................................................................................. 85
7.11.3 Input Device Hysteresis .......................................................................... 85
8 Processor Pin and Signal Information...................................................................... 87
8.1 Processor Pin Assignments ................................................................................. 87
9 DDR Data Swizzling ............................................................................................... 107
- 2nd Generation Intel 1
- Processor Family Desktop 1
- 2 Datasheet, Volume 1 2
- Contents 3
- 4 Datasheet, Volume 1 4
- Datasheet, Volume 1 5 5
- 6 Datasheet, Volume 1 6
- Datasheet, Volume 1 7 7
- Revision History 8
- 1 Introduction 9
- Processor 10
- 1.1 Processor Feature Details 11
- 1.2 Interfaces 11
- 1.2.2 PCI Express* 12
- Datasheet, Volume 1 13 13
- Introduction 13
- 1.2.5 Processor Graphics 14
- 1.2.6 Intel 14
- 1.3 Power Management Support 15
- 1.5 Package 16
- 1.6 Terminology 16
- 1.7 Related Documents 18
- 2 Interfaces 19
- Interfaces 20
- 2.1.3.1 Single-Channel Mode 21
- Flex Memory Technology Mode 21
- Fast Memory Access 22
- 2.1.5.2 Command Overlap 23
- 2.2 PCI Express* Interface 24
- 2.2.1.1 Transaction Layer 25
- 2.2.1.2 Data Link Layer 25
- 2.2.1.3 Physical Layer 25
- 2.2.3 PCI Express* Port 26
- 2.3.1 DMI Error Flow 27
- 2.3.3 DMI Link Down 28
- 2.4.1.2 3D Pipeline 29
- 2.4.1.3 Video Engine 30
- 2.4.1.4 2D Engine 30
- 2.4.2.1 Display Planes 31
- 2.4.2.2 Display Pipes 32
- 2.4.2.3 Display Ports 32
- 2.6 Interface Clocking 33
- 3 Technologies 35
- 3.1.2 Intel 36
- VT-x Features 36
- 3.1.3 Intel 36
- VT-d Objectives 36
- 3.1.4 Intel 37
- VT-d Features 37
- 3.1.5 Intel 37
- VT-d Features Not Supported 37
- 3.2 Intel 38
- 3.3 Intel 38
- Hyper-Threading Technology 38
- 3.4 Intel 39
- Turbo Boost Technology 39
- 3.5 Intel 40
- (AES-NI) 40
- 3.7 Intel 41
- 64 Architecture x2APIC 41
- Technologies 42
- 4 Power Management 43
- 4.1.4 PCIe Link States 44
- 4.1.5 DMI States 44
- 4.2.1 Enhanced Intel 45
- SpeedStep 45
- Technology 45
- 4.2.2 Low-Power Idle States 46
- 4.2.4.1 Core C0 State 48
- 4.2.4.2 Core C1/C1E State 48
- 4.2.4.3 Core C3 State 48
- 4.2.4.4 Core C6 State 48
- 4.2.4.5 C-State Auto-Demotion 48
- 4.2.5 Package C-States 49
- 4.2.5.1 Package C0 50
- 4.2.5.2 Package C1/C1E 51
- 4.2.5.3 Package C3 State 51
- 4.2.5.4 Package C6 State 51
- 4.3 IMC Power Management 52
- Datasheet, Volume 1 53 53
- Power Management 53
- 4.4 PCIe* Power Management 54
- 4.5 DMI Power Management 55
- 4.6 Graphics Power Management 55
- 4.7 Thermal Power Management 56
- 5 Thermal Management 57
- Thermal Management 58
- 6 Signal Description 59
- 6.1 System Memory Interface 60
- Table 6-3. Memory Channel B 61
- 6.5 Intel 63
- 6.7 PLL Signals 64
- 6.8 TAP Signals 64
- 6.10 Power Sequencing 65
- 6.11 Processor Power Signals 66
- 6.12 Sense Pins 66
- 6.13 Ground and NCTF 66
- Signal Description 68
- 7 Electrical Specifications 69
- Voltage Identification (VID) 70
- Electrical Specifications 72
- 7.5 System Agent (SA) VCC VID 74
- 7.7 Signal Groups 75
- 7.10 DC Specifications 78
- (Sheet 2 of 2) 79
- Specifications 80
- DC Specifications 84
- 7.11.2 DC Characteristics 85
- 8 Processor Pin and Signal 87
- 88 Datasheet, Volume 1 88
- Datasheet, Volume 1 89 89
- 90 Datasheet, Volume 1 90
- Datasheet, Volume 1 91 91
- 106 Datasheet, Volume 1 106
- 9 DDR Data Swizzling 107
- Table – Channel A 108
- Table – Channle B 109
- DDR Data Swizzling 110
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