Intel BX80570E8200A Datasheet Page 95
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Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines 95
12. Place a 3
rd
piece of tape at the end of the step in the groove as shown in
Figure
7-22. This tape will create a solder dam to prevent solder from flowing into
the larger IHS groove section during the melting process.
13. Measure resistance from thermocouple end wires (hold both wires to a DMM
probe) to the IHS surface. This should be the same value as measured during the
thermocouple conditioning Section
D.5.1.step 3 (Figure 7-23).
Figure
7-23. Measuring Resistance between Thermocouple and IHS
14. Using a fine point device, place a small amount of flux on the thermocouple bead.
Be careful not to move the thermocouple bead during this step (Figure
7-24).
Ensure the flux remains in the bead area only.
- Contents 3
- Figures 6
- Revision History 9
- 1 Introduction 11
- 1.1.3 Document Scope 12
- 1.2 References 13
- 1.3 Definition of Terms 13
- measurements 14
- Information 15
- 2.1.2 Heatsink Attach 17
- 2.2 Thermal Requirements 18
- 2.2.2 Thermal Profile 19
- 2.2.4 T 20
- 7, Intel 21
- 2.3.4 and 21
- 2.3.1 Heatsink Size 22
- 2.3.2 Heatsink Mass 22
- 2.3.3 Package IHS Flatness 23
- 2.4.3 Summary 25
- 3 Thermal Metrology 27
- 3.1.1 Example 28
- Assessment 29
- Guidelines 29
- 3-3. The 30
- Thermal Metrology 31
- Thermal Monitor Feature 33
- 4.2.1 PROCHOT# Signal 34
- 4.2.3 Thermal Monitor 2 35
- 4.2.5 On-Demand Mode 37
- 4.2.6 System Considerations 37
- Considerations 38
- 4.2.8 THERMTRIP# Signal 38
- 7 and the Intel 40
- (BTX) Thermal/Mechanical 41
- Design Information 41
- 5.1.2 Acoustics 42
- 5.1.3 Effective Fan Curve 43
- Airflow (cfm) 44
- 5.1.5 Altitude 45
- 5-2. Random Vibration PSD 46
- 5.2.2 Power Cycling 47
- 5.4 Safety Requirements 49
- Thermal Module Assembly 49
- Detail A 52
- Detail B 52
- 6 ATX Thermal/Mechanical 53
- Appendix H 54
- 6.2.1 Heatsink Performance 55
- 6.2.2 Acoustics 56
- 6.2.3 Altitude 56
- 3.3 and 6.6) 57
- 6-3. Random Vibration PSD 58
- 6.3.2 Power Cycling 59
- 6.5 Safety Requirements 61
- Thermal Mechanical Design 61
- Less curvature in 62
- Shock Load 62
- Core shoulder 63
- 7 Intel 65
- Quiet System 65
- Technology (Intel 65
- 7-1. Intel 66
- RPM Temperature 67
- 7-3 and listed below: 68
- 7-3. Intel 68
- 7.3 Intel 70
- A.3.1, and A.3.2 76
- Metrology 77
- B.1 Overview 77
- B.2 Test Preparation 77
- Heatsink Clip Load Metrology 78
- Load Cells (3x) 79
- Preload Fixture (copper 79
- B.3 Test Procedure Examples 80
- Measurement 81
- Appendix C Thermal Interface 83
- Management 83
- C.1 Bond Line Management 83
- C.2 Interface Material Area 83
- Thermal Interface Management 84
- Appendix D Case Temperature 85
- Reference Metrology 85
- D.1 Objective and Scope 85
- 7-11. Order 86
- 7-11. Omega Thermocouple 86
- D.4 IHS Groove 87
- 7-14 for the 775-Land 90
- D.2 and D.3 91
- 7-16) 91
- 7-17) 91
- 7-19-A and B) 92
- TC Wire with Insulation 94
- IHS with Groove 94
- 7-24) 95
- 7-25) 96
- 7-25. Cutting Solder 96
- 7-26) 96
- D.5.3 Solder Process 97
- 7-27. Solder Station Setup 98
- 7-28 and Figure 7-29) 98
- Installation 100
- 7-32) 101
- 7-33) 101
- 7-34) 102
- 7-36) 103
- Extended (BTX) System 105
- Thermal Considerations 105
- Thermal 107
- MCH Heatsink 107
- Reference Design 109
- BOARD PRIMARY SIDE 112
- BOARD SECONDARY SIDE 113
- Mechanical Drawings 114
- Figure 7-54. Intel 126
- Appendix H Intel 127
- Enabled Reference 127
- Solution Information 127
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