Intel BX80570E8200A Datasheet Page 5
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Thermal and Mechanical Design Guidelines 5
7.2 Board and System Implementation of Intel
®
QST......................................68
7.3 Intel
®
QST Configuration & Tuning..........................................................70
7.4 Fan Hub Thermistor and Intel
®
QST ........................................................70
Appendix A LGA775 Socket Heatsink Loading ......................................................................71
A.1 LGA775 Socket Heatsink Considerations ..................................................71
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant
with Intel
®
Reference Design .................................................................71
A.3 Heatsink Preload Requirement Limitations................................................71
A.3.1 Motherboard Deflection Metric Definition.....................................72
A.3.2 Board Deflection Limits ............................................................73
A.3.3 Board Deflection Metric Implementation Example.........................74
A.3.4 Additional Considerations .........................................................75
A.3.4.1 Motherboard Stiffening Considerations .........................76
A.4 Heatsink Selection Guidelines.................................................................76
Appendix B Heatsink Clip Load Metrology............................................................................77
B.1 Overview ............................................................................................77
B.2 Test Preparation...................................................................................77
B.2.1 Heatsink Preparation................................................................77
B.2.2 Typical Test Equipment ............................................................80
B.3 Test Procedure Examples.......................................................................80
B.3.1 Time-Zero, Room Temperature Preload Measurement...................81
B.3.2 Preload Degradation under Bake Conditions ................................81
Appendix C Thermal Interface Management.........................................................................83
C.1 Bond Line Management .........................................................................83
C.2 Interface Material Area..........................................................................83
C.3 Interface Material Performance...............................................................83
Appendix D Case Temperature Reference Metrology..............................................................85
D.1 Objective and Scope .............................................................................85
D.2 Supporting Test Equipment....................................................................85
D.3 Thermal calibration and controls.............................................................87
D.4 IHS Groove .........................................................................................87
D.5 Thermocouple Attach Procedure .............................................................91
D.5.1 Thermocouple Conditioning and Preparation ................................91
D.5.2 Thermocouple Attachment to the IHS.........................................92
D.5.3 Solder Process ........................................................................97
D.5.4 Cleaning & Completion of Thermocouple Installation................... 100
D.6 Thermocouple Wire Management .......................................................... 104
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations.................. 105
Appendix F Fan Performance for Reference Design ............................................................. 109
Appendix G Mechanical Drawings ..................................................................................... 111
Appendix H Intel
®
Enabled Reference Solution Information .................................................. 127
- Contents 3
- Figures 6
- Revision History 9
- 1 Introduction 11
- 1.1.3 Document Scope 12
- 1.2 References 13
- 1.3 Definition of Terms 13
- measurements 14
- Information 15
- 2.1.2 Heatsink Attach 17
- 2.2 Thermal Requirements 18
- 2.2.2 Thermal Profile 19
- 2.2.4 T 20
- 7, Intel 21
- 2.3.4 and 21
- 2.3.1 Heatsink Size 22
- 2.3.2 Heatsink Mass 22
- 2.3.3 Package IHS Flatness 23
- 2.4.3 Summary 25
- 3 Thermal Metrology 27
- 3.1.1 Example 28
- Assessment 29
- Guidelines 29
- 3-3. The 30
- Thermal Metrology 31
- Thermal Monitor Feature 33
- 4.2.1 PROCHOT# Signal 34
- 4.2.3 Thermal Monitor 2 35
- 4.2.5 On-Demand Mode 37
- 4.2.6 System Considerations 37
- Considerations 38
- 4.2.8 THERMTRIP# Signal 38
- 7 and the Intel 40
- (BTX) Thermal/Mechanical 41
- Design Information 41
- 5.1.2 Acoustics 42
- 5.1.3 Effective Fan Curve 43
- Airflow (cfm) 44
- 5.1.5 Altitude 45
- 5-2. Random Vibration PSD 46
- 5.2.2 Power Cycling 47
- 5.4 Safety Requirements 49
- Thermal Module Assembly 49
- Detail A 52
- Detail B 52
- 6 ATX Thermal/Mechanical 53
- Appendix H 54
- 6.2.1 Heatsink Performance 55
- 6.2.2 Acoustics 56
- 6.2.3 Altitude 56
- 3.3 and 6.6) 57
- 6-3. Random Vibration PSD 58
- 6.3.2 Power Cycling 59
- 6.5 Safety Requirements 61
- Thermal Mechanical Design 61
- Less curvature in 62
- Shock Load 62
- Core shoulder 63
- 7 Intel 65
- Quiet System 65
- Technology (Intel 65
- 7-1. Intel 66
- RPM Temperature 67
- 7-3 and listed below: 68
- 7-3. Intel 68
- 7.3 Intel 70
- A.3.1, and A.3.2 76
- Metrology 77
- B.1 Overview 77
- B.2 Test Preparation 77
- Heatsink Clip Load Metrology 78
- Load Cells (3x) 79
- Preload Fixture (copper 79
- B.3 Test Procedure Examples 80
- Measurement 81
- Appendix C Thermal Interface 83
- Management 83
- C.1 Bond Line Management 83
- C.2 Interface Material Area 83
- Thermal Interface Management 84
- Appendix D Case Temperature 85
- Reference Metrology 85
- D.1 Objective and Scope 85
- 7-11. Order 86
- 7-11. Omega Thermocouple 86
- D.4 IHS Groove 87
- 7-14 for the 775-Land 90
- D.2 and D.3 91
- 7-16) 91
- 7-17) 91
- 7-19-A and B) 92
- TC Wire with Insulation 94
- IHS with Groove 94
- 7-24) 95
- 7-25) 96
- 7-25. Cutting Solder 96
- 7-26) 96
- D.5.3 Solder Process 97
- 7-27. Solder Station Setup 98
- 7-28 and Figure 7-29) 98
- Installation 100
- 7-32) 101
- 7-33) 101
- 7-34) 102
- 7-36) 103
- Extended (BTX) System 105
- Thermal Considerations 105
- Thermal 107
- MCH Heatsink 107
- Reference Design 109
- BOARD PRIMARY SIDE 112
- BOARD SECONDARY SIDE 113
- Mechanical Drawings 114
- Figure 7-54. Intel 126
- Appendix H Intel 127
- Enabled Reference 127
- Solution Information 127
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