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Thermal Specifications and Design Considerations
84 Datasheet
3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic
mode is used to indicate that the maximum T
J
has been reached. Refer to Section 5.1 for details.
4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within
specifications.
5. At Tj of 100
o
C
6. At Tj of 50
o
C
7. At Tj of 35
o
C
8. 512-KB L2 cache
Table 25. Power Specifications for the Ultra Low Voltage Dual-Core 1M Cache Intel
Celeron (SFF) Genuine Intel Processor
NOTES:
1. The TDP specification should be used to design the processor thermal solution. The TDP is not the
maximum theoretical power the processor can generate.
2. Not 100% tested. These power specifications are determined by characterization of the processor currents
at higher temperatures and extrapolating the values for the temperature indicated.
3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic
mode is used to indicate that the maximum T
J
has been reached. Refer to Section 5.1
for more details.
4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within
specifications.
5. At Tj of 100
o
C
6. At Tj of 50 °C
7. At Tj of 35
o
C
5.1 Monitoring Die Temperature
The processor incorporates three methods of monitoring die temperature:
•Thermal Diode
• Intel Thermal Monitor
• Digital Thermal Sensor
Symbol
Processor
Number
Core Frequency
Thermal Design
Power
Unit Notes
TDP SU2300 1.2 GHz 10 W 1, 4, 5
Symbol Parameter Min Typ Max Unit Notes
P
AH,
P
SGNT
Auto Halt, Stop Grant Power 2.9 W 2, 6
P
SLP
Sleep Power 2.9 W 2, 6
P
DSLP
Deep Sleep Power 1.3 W 2,7
P
DPRSLP
Deeper Sleep Power 0.6 W 2, 7
T
J
Junction Temperature 0 100 °C3,4
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