Intel T1700 Datasheet Page 38

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Package Mechanical Specifications and Pin Information
38 Datasheet
Figure 7. SFF (ULV DC) Die Micro-FCBGA Processor Package Drawing
ø0.14
A
A
B
L
C
ø0.04
ø0.46±0.04
(Metal Diameter)
ø0.39±0.02
(Solder Resist Opening)
L
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