Intel 8mb User Manual download pdf (Page 11)

Figure 3. Attachment to Motherboard

Socket Components

The socket has two main components, the socket body and Pick and Place (PnP)

cover, and is delivered as a single integral assembly. Refer to Socket Mechanical

Drawings for detailed drawings.

Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating

capable of withstanding 260 °C for 40 seconds, which is compatible with typical

reflow/rework profiles. The socket coefficient of thermal expansion (in the XY plane)

and creep properties must be such that the integrity of the socket is maintained for

the conditions listed in LGA1150 Socket and ILM Specifications on page 24.

The color of the housing will be dark as compared to the solder balls to provide the

contrast needed for pick and place vision systems.

Solder Balls

A total of 1150 solder balls corresponding to the contacts are on the bottom of the

socket for surface mounting with the motherboard. The socket solder ball has the

following characteristics:

2.3

LGA1150 Socket—LGA1150 Socket

LGA1150 Socket

September 2013 Application Guide

Order No.: 328999-002 11

1 2 ... 6 7 8 9 10 11 12 13 14 15 16 ... 35 36

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Intel 8mb User Manual Page 11