Intel mPGA604 User Manual Page 43
- Page / 52
- Table of contents
- BOOKMARKS
- Design Guidelines 1
- Revision 1.0 1
- October 2003 1
- Contents 3
- Figures 4
- Revision History 6
- 1 Introduction 9
- 2 Assembled Component and 11
- Package Description 11
- 3 Mechanical Requirements 13
- 3.5 Markings 14
- 3.6 Socket Size 15
- 3.9 Contact Characteristics 15
- 3.9.6 Lubricants 16
- 4 Electrical Requirements 19
- 4.1 Electrical Resistance 20
- Electrical Requirements 23
- 4.3 Inductance 24
- LLL −= 26
- 4.4 Pin-to-Pin Capacitance 27
- 4.6 Insulation Resistance 27
- 4.7 Contact Current Rating 27
- 5.1 Porosity Test 30
- 5.2 Plating Thickness 30
- 5.3 Solvent Resistance 30
- 5.4 Solderability 30
- 5.5 Durability 31
- 7 Safety Requirements 35
- A Appendix A 39
- Appendix A 47
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