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Intel AT80571AH0722ML Datasheet Page 82
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Therm
al Inter
face Manage
ment
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Thermal and Mec
hanical Design Guide
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Contents
3
Figures
6
Revision History
8
1 Introduction
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1.1.3 Document Scope
10
1.2 References
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1.3 Definition of Terms
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Ψ measurements
12
Information
13
2.1.2 Heatsink Attach
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2.2 Thermal Requirements
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2.2.2 Thermal Profile
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2.2.4 T
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2.3.1 Heatsink Size
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2.3.2 Heatsink Mass
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2.3.3 Package IHS Flatness
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2.4.3 Summary
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3 Thermal Metrology
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3.1.1 Example
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Assessment
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Guidelines
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Thermal Metrology
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Thermal Monitor Feature
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4.2.1 PROCHOT# Signal
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4.2.3 Thermal Monitor 2
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4.2.5 On-Demand Mode
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4.2.6 System Considerations
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Considerations
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4.2.8 THERMTRIP# Signal
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(BTX) Thermal/Mechanical
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Design Information
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5.1.2 Acoustics
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5.1.3 Effective Fan Curve
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Airflow (cfm)
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5.1.5 Altitude
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5.2.2 Power Cycling
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5.4 Safety Requirements
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Reference BTX
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Thermal Module Assembly
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Less curvature in region
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Shock Load
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6 ATX Thermal/Mechanical
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6.2.1 Heatsink Performance
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6.2.2 Acoustics
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6.2.3 Altitude
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PSD (g^2/Hz)
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6.3.2 Power Cycling
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6.5 Safety Requirements
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Reference ATX
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Thermal Mechanical Design
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Less curvature in
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Core shoulder
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Φ36.14 +/- 0.10 mm
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Φ38.68 +/- 0.30 mm
62
7 Intel
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Quiet System
63
Technology (Intel
63
(Output Weighting Matrix)
64
RPM Temperature
65
Intel® (G)MCH
66
7.3 Intel
68
Loading
69
Metrology
75
Heatsink Clip Load Metrology
76
Load Cells (3x)
77
Preload Fixture (copper
77
B.3 Test Procedure Examples
78
Measurement
79
Appendix C Thermal Interface
81
Management
81
Thermal Interface Management
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Appendix D Case Temperature
83
Reference Metrology
83
D.4 IHS Groove
85
TC Wire with Insulation
92
IHS with Groove
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D.5.3 Solder Process
95
Installation
98
Extended (BTX) System
103
Thermal Considerations
103
TMA Airflow
105
Reference Design
107
BOARD PRIMARY SIDE
110
BOARD SECONDARY SIDE
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Mechanical Drawings
112
Figure 7-54. Intel
124
Appendix H Intel
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Enabled Reference
125
Solution Information
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