Intel AT80571AH0722ML Datasheet Page 69
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LGA775 Socket Heatsink Loading
Thermal and Mechanical Design Guidelines 69
Appendix A LGA775 Socket Heatsink
Loading
A.1 LGA775 Socket Heatsink Considerations
Heatsink clip load is traditionally used for:
• Mechanical performance in mechanical shock and vibration
Refer to Section 6.7.1 for the information on the structural design strategy for the
reference design
• Thermal interface performance
Required preload depends on TIM
Preload can be low for thermal grease
In addition to mechanical performance in shock and vibration and TIM performance,
LGA775 socket requires a minimum heatsink preload to protect against fatigue failure
of socket solder joints.
Solder ball tensile stress is originally created when, after inserting a processor into the
socket, the LGA775 socket load plate is actuated. In addition, solder joint shear stress
is caused by coefficient of thermal expansion (CTE) mismatch induced shear loading.
The solder joint compressive axial force (F
axial
) induced by the heatsink preload helps
to reduce the combined joint tensile and shear stress.
Overall, the heatsink required preload is the minimum preload needed to meet all of
the above requirements—Mechanical shock and vibration and TIM performance AND
LGA775 socket protection against fatigue failure.
A.2 Metric for Heatsink Preload for ATX/uATX
Designs Non-Compliant with Intel
®
Reference Design
A.3 Heatsink Preload Requirement Limitations
Heatsink preload by itself is not an appropriate metric for solder joint force across
various mechanical designs and does not take into account for example (not an
exhaustive list):
• Heatsink mounting hole span
• Heatsink clip/fastener assembly stiffness and creep
• Board stiffness and creep
• Board stiffness is modified by fixtures like backing plate, chassis attach, and so
forth.
- Contents 3
- Figures 6
- Revision History 8
- 1 Introduction 9
- 1.1.3 Document Scope 10
- 1.2 References 11
- 1.3 Definition of Terms 11
- Ψ measurements 12
- Information 13
- 2.1.2 Heatsink Attach 15
- 2.2 Thermal Requirements 16
- 2.2.2 Thermal Profile 17
- 2.2.4 T 18
- 2.3.1 Heatsink Size 20
- 2.3.2 Heatsink Mass 20
- 2.3.3 Package IHS Flatness 21
- 2.4.3 Summary 23
- 3 Thermal Metrology 25
- 3.1.1 Example 26
- Assessment 27
- Guidelines 27
- Thermal Metrology 28
- Thermal Monitor Feature 31
- 4.2.1 PROCHOT# Signal 32
- 4.2.3 Thermal Monitor 2 33
- 4.2.5 On-Demand Mode 35
- 4.2.6 System Considerations 35
- Considerations 36
- 4.2.8 THERMTRIP# Signal 36
- (BTX) Thermal/Mechanical 39
- Design Information 39
- 5.1.2 Acoustics 40
- 5.1.3 Effective Fan Curve 41
- Airflow (cfm) 42
- 5.1.5 Altitude 43
- 5.2.2 Power Cycling 45
- 5.4 Safety Requirements 47
- Reference BTX 47
- Thermal Module Assembly 47
- Less curvature in region 48
- Shock Load 48
- 6 ATX Thermal/Mechanical 51
- 6.2.1 Heatsink Performance 53
- 6.2.2 Acoustics 54
- 6.2.3 Altitude 54
- PSD (g^2/Hz) 56
- 6.3.2 Power Cycling 57
- 6.5 Safety Requirements 59
- Reference ATX 59
- Thermal Mechanical Design 59
- Less curvature in 60
- Core shoulder 61
- Φ36.14 +/- 0.10 mm 62
- Φ38.68 +/- 0.30 mm 62
- 7 Intel 63
- Quiet System 63
- Technology (Intel 63
- (Output Weighting Matrix) 64
- RPM Temperature 65
- Intel® (G)MCH 66
- 7.3 Intel 68
- Loading 69
- Metrology 75
- Heatsink Clip Load Metrology 76
- Load Cells (3x) 77
- Preload Fixture (copper 77
- B.3 Test Procedure Examples 78
- Measurement 79
- Appendix C Thermal Interface 81
- Management 81
- Thermal Interface Management 82
- Appendix D Case Temperature 83
- Reference Metrology 83
- D.4 IHS Groove 85
- TC Wire with Insulation 92
- IHS with Groove 92
- D.5.3 Solder Process 95
- Installation 98
- Extended (BTX) System 103
- Thermal Considerations 103
- TMA Airflow 105
- Reference Design 107
- BOARD PRIMARY SIDE 110
- BOARD SECONDARY SIDE 111
- Mechanical Drawings 112
- Figure 7-54. Intel 124
- Appendix H Intel 125
- Enabled Reference 125
- Solution Information 125
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