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Boxed Processor Specifications
104 Datasheet
Figure 36. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)
Figure 37. Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)
- Datasheet 1
- 2 Datasheet 2
- Contents 3
- 4 Datasheet 4
- Datasheet 5 5
- 6 Datasheet 6
- Revision History 7
- 8 Datasheet 8
- Datasheet 9 9
- 10 Datasheet 10
- 1 Introduction 11
- 1.1 Terminology 12
- Datasheet 13 13
- Introduction 13
- 1.2 References 14
- 2.1 Power and Ground Lands 15
- 2.2 Decoupling Guidelines 15
- 2.3 Voltage Identification 16
- Datasheet 17 17
- Electrical Specifications 17
- 18 Datasheet 18
- Datasheet 19 19
- 20 Datasheet 20
- Datasheet 21 21
- 1, 2, 3, 4 22
- Figure 1. V 23
- Overshoot 24
- 2.6.4 Die Voltage Validation 24
- 2.7 Signaling Specifications 25
- 26 Datasheet 26
- Datasheet 27 27
- 28 Datasheet 28
- 2.7.4 Clock Specifications 29
- 30 Datasheet 30
- Datasheet 31 31
- VHavg (mV) 32
- 250 + 0.5 (VHavg - 700) 32
- 550 + 0.5 (VHavg - 700) 32
- 2.8 PECI DC Specifications 33
- 34 Datasheet 34
- 3 Package Mechanical 35
- 36 Datasheet 36
- Datasheet 37 37
- 38 Datasheet 38
- INTEL ©'05 E6850 40
- INTEL® CORE™2 DUO 40
- SLxxx [COO] 40
- 3.00GHZ/4M/1333/06 40
- Datasheet 41 41
- INTEL ©'05 E4500 42
- 2.20GHZ/2M/800/06 42
- Preliminary 43
- Socket 775 43
- Quadrants 43
- Top View 43
- 44 Datasheet 44
- 4 Land Listing and Signal 45
- Descriptions 45
- 46 Datasheet 46
- Datasheet 47 47
- Table 23. Alphabetical Land 48
- Assignments 48
- Table 24. Numerical Land 58
- Assignment 58
- 68 Datasheet 68
- Datasheet 69 69
- 70 Datasheet 70
- Datasheet 71 71
- 72 Datasheet 72
- Datasheet 73 73
- 74 Datasheet 74
- Datasheet 75 75
- 76 Datasheet 76
- 5 Thermal Specifications and 77
- Design Considerations 77
- Table 27. Thermal Profile 1 79
- Figure 19. Thermal Profile 1 79
- Table 28. Thermal Profile 2 80
- Figure 20. Thermal Profile 2 80
- Table 29. Thermal Profile 3 81
- Figure 21. Thermal Profile 3 81
- Table 30. Thermal Profile 4 82
- Figure 22. Thermal Profile 4 82
- Table 31. Thermal Profile 5 83
- Figure 23. Thermal Profile 5 83
- 84 Datasheet 84
- 5.2.2 Thermal Monitor 2 85
- 86 Datasheet 86
- 5.2.4 PROCHOT# Signal 87
- 5.2.5 THERMTRIP# Signal 87
- 5.3 Thermal Diode 88
- Datasheet 89 89
- PECI Host 90
- Controller 90
- Domain 0 90
- Datasheet 91 91
- 5.4.2.1 PECI Device Address 92
- 5.4.2.2 PECI Command Support 92
- 6 Features 93
- 6.2.2.1 HALT Powerdown State 94
- 6.2.3.1 Stop Grant State 95
- 6.3 Enhanced Intel 96
- SpeedStep 96
- Technology 96
- Datasheet 97 97
- Features 97
- 98 Datasheet 98
- Datasheet 99 99
- 7.1 Mechanical Specifications 100
- 7.2 Electrical Requirements 101
- BdP PCbl 102
- 7.3 Thermal Specifications 103
- 104 Datasheet 104
- Datasheet 105 105
- 106 Datasheet 106
- (BTX) Boxed Processor 107
- Specifications 107
- 8.1 Mechanical Specifications 108
- Datasheet 109 109
- 110 Datasheet 110
- Datasheet 111 111
- 8.2 Electrical Requirements 112
- (hatched area) 113
- 8.3 Thermal Specifications 114
- Datasheet 115 115
- 116 Datasheet 116
- 9 Debug Tools Specifications 117
- Debug Tools Specifications 118
- 118 Datasheet 118
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