Intel BK80524P533128 Datasheet download pdf (Page 117)

Datasheet 117

Intel

Celeron

Processor up to 1.10 GHz

6.2.1.2 Boxed Processor Thermal Cooling Solution Clip

The boxed processor thermal solution requires installation by a system integrator to secure the

thermal cooling solution to the processor after it is installed in the 370-pin socket ZIF socket.

Motherboards designed for use by system integrators should take care to consider the implications

of clip installation and potential scraping of the motherboard PCB underneath the 370-pin socket

attach tabs. Motherboard components should not be placed too close to the 370-pin socket attach

tabs in a way that interferes with the installation of the boxed processor thermal cooling solution

(see Figure 41 for specifications).

6.3 Electrical Requirements for the Boxed Intel

Celeron

Processor

6.3.1 Electrical Requirements

The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable is shipped

with the boxed processor to draw power from a power header on the motherboard. The power cable

connector and pin-out are shown in Figure 42. Motherboards must provide a matched power header

to support the boxed processor. Table 58 contains specifications for the input and output signals at

the fan heatsink connector. The fan heatsink outputs a SENSE signal (an open-collector output)

that pulses at a rate of two pulses per fan revolution. A motherboard pull-up resistor provides V

to match the motherboard-mounted fan speed monitor requirements, if applicable. Use of the

SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to

GND.

Figure 41. Clip Keepout Requirements for the 370-Pin (Top View)

1 2 ... 112 113 114 115 116 117 118 119 120 121 122 ... 127 128

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Intel BK80524P533128 Datasheet Page 117