Intel B80532PG0962M Datasheet download pdf (Page 78)

78 Intel

Pentium

4 Processor on 0.13 Micron Process Datasheet

Boxed Processor Specifications

7.2 Mechanical Specifications

7.2.1 Boxed Processor Cooling Solution Dimensions

This section describes the mechanical specifications of the boxed Pentium 4 processor on

0.13 micron process. The boxed processor will be shipped with an unattached fan heatsink.

Figure 7-1 shows a mechanical representation of the boxed Pentium 4 processor on 0.13 micron

process.

Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The

physical space requirements and dimensions for the boxed processor with assembled fan heatsink

are shown in Figure 7-2 (Side Views), and Figure 7-3 (Top View). The airspace requirements for

the boxed processor fan heatsink must also be incorporated into new motherboard and system

designs. Airspace requirements are shown in Figure 7-6 and Figure 7-7. Note that some figures

have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.

Figure 7-2. Side View Space Requirements for the Boxed Processor

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Intel B80532PG0962M Datasheet Page 78