Intel AV8062701048800 Datasheet

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Document Number: 327405-001
Intel
®
Xeon
®
and Intel
®
Core™
Processors For Communications
Infrastructure
Datasheet - Volume 1 of 2
Supporting:
Intel
®
Xeon
®
Processor E3-1125C
Intel
®
Xeon
®
Processor E3-1105C
Intel
®
Core™ i3 Processor 2115C
Intel
®
Pentium
®
Processor B915C
Intel
®
Celeron
®
Processor 725C
Document #324803 - 2nd Generation Intel
®
Core™ Processor Family Mobile Datasheet -
Volume 2 completes the documentation set and contains additional product information.
May 2012
Page view 0
1 2 3 4 5 6 ... 163 164

Summary of Contents

Page 1 - May 2012

Document Number: 327405-001Intel® Xeon® and Intel® Core™ Processors For Communications InfrastructureDatasheet - Volume 1 of 2Supporting: Intel® Xeo

Page 2 - Legal Lines and Disclaimers

ContentsIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureDatasheet - Volume 1 of 2 May 201210 Document Number: 327405-001

Page 3 - Revision History

Electrical SpecificationsIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureDatasheet - Volume 1 of 2 May 2012100 Document Numb

Page 4 - Contents

Electrical SpecificationsIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureMay 2012 Datasheet - Volume 1 of 2Document Number:

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Page 11 - 1.0 Introduction

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Page 12

Electrical SpecificationsIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureMay 2012 Datasheet - Volume 1 of 2Document Number:

Page 13 - 1.3 Terminology

IntroductionIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureMay 2012 Datasheet 1 of 2Document Number: 327405-001 111.0 Intro

Page 14

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Page 15 - 2.0 Product Overview

Electrical SpecificationsIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureMay 2012 Datasheet - Volume 1 of 2Document Number:

Page 16 - Processor

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Page 17 - 2.4 Interface Features

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Page 18 - 2.4.2 PCI Express*

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Page 21 - 2.8 Testability

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Page 23 - 3.0 Interfaces

Processor Ball and Package InformationIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureMay 2012 Datasheet - Volume 1 of 2Docu

Page 24 - 3.1.1.1 UDIMM Configurations

IntroductionIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureDatasheet 1 of 2 May 201212 Document Number: 327405-001Table 1-2

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Page 27 - Flex Memory Technology Mode

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Page 28 - Fast Memory Access

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Page 29 - 3.1.5.2 Command Overlap

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Page 30

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Page 31 - 3.2.1.3 Physical Layer

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Page 35 - 3.2.5 Configuring PCIe* Lanes

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Page 36 - 3.3 Direct Media Interface

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Page 37 - 3.5 Interface Clocking

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Page 38

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Page 39 - 4.0 Technologies

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Page 40 - VT-d Features

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Page 41 - 4.3 Intel

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Page 42 - 4.4.1 PCLMULQDQ Instruction

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Page 45 - 5.0 Processor SKUs

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IntroductionIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureDatasheet 1 of 2 May 201214 Document Number: 327405-001§ §PCU Po

Page 47 - 6.0 Power Management

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Page 48 - 6.1 ACPI States Supported

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Page 49 - 6.1.5 DMI States

Processor Ball and Package InformationIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureDatasheet - Volume 1 of 2 May 2012142

Page 50 - Core 0 State

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Page 51 - C1 C1E C7C6C3

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Page 52 - 6.2.4.2 Core C1/C1E State

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Page 53 - 6.2.4.6 C-State Auto-Demotion

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Page 55 - 6.2.5.2 Package C1/C1E

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Page 56 - 6.2.5.5 Package C7 State

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Page 57 - 6.3 IMC Power Management

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Page 58

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Page 59 - 6.4 PCIe* Power Management

Processor Configuration RegistersIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureMay 2012 Datasheet - Volume 1 of 2Document

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Page 61 - 7.0 Thermal Management

Processor Configuration RegistersIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureMay 2012 Datasheet - Volume 1 of 2Document

Page 62 - Table 7-1. TDP Specifications

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Page 66 - 7.3.1.3 PROCHOT# Signal

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Page 68 - 7.3.2.1 On-Demand Mode

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Page 71 - 8.0 Signal Description

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Page 76 - 8.7 TAP Signals

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Page 78 - 8.9 Power Sequencing

Product OverviewIntel® Xeon® and Intel® Core™ Processors For Communications InfrastructureDatasheet - Volume 1 of 2 May 201220 Document Number: 327405

Page 79 - 8.12 Future Compatibility

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Page 81 - 9.0 Electrical Specifications

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Page 82 - 9.3.1 PLL Power Supply

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Page 89 - 9.5 System Agent (SA) Vcc VID

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Page 90 - 9.7 Signal Groups

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Page 93 - 9.10 DC Specifications

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Page 98 - ± 200mV and the edge must be

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Page 101 - 9.11 AC Specifications

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Page 103 - 9.11.1 DDR3 AC Specifications

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Page 104 - = 1.5 V ±0.075 V

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Page 110 - Cl ock-Cl ock#

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Page 111 - Programmable

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Page 115 - Overshoot Specification

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Page 116 - Voltage (V)

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Page 152 - 11.1 ERRSTS - Error Status

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Page 153 - 11.2 ERRCMD - Error Command

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Page 154 - 11.3 SMICMD - SMI Command

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Page 155 - 11.4 SCICMD - SCI Command

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