Intel 955X User Manual download pdf (Page 19)

Reference Thermal Solution

R

Intel

®

955X Express Chipset Thermal/Mechanical Design Guide 19

Figure 6-2. Heatsink Volumetric Envelope for the MCH

TN B

Motherboard

Heatsink Base

Die

FCBGA + Solder

Balls

Heatsink Fin

Heatsink Fin

Ramp

Retainer

TIM

33.50 mm

26.79 mm

48.0 mm

60.6 mm

47.0 mm

135

O

45.79 mm

67.0 mm

81.0 mm

60.92 mm

Max 2.2 m m

Component

Height

No

component

this Area

1.90 mm

2.50 mm

HS_Vol_Envelope_MCH

1 2 ... 14 15 16 17 18 19 20 21 22 23 24 ... 35 36

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