Intel BK80524P533128 Datasheet download pdf (Page 110)

110 Datasheet

Intel

Celeron

Processor up to 1.10 GHz

6.0 Boxed Processor Specifications

The Celeron processor is also offered as an Intel boxed processor in the FC-PGA/FC-PGA2,

PPGA, and S.E.P. Packages. Intel boxed processors are intended for system integrators who build

systems from motherboards and standard components. The boxed Celeron processor in the S.E.P.

Package is supplied with an attached fan heatsink. The boxed Celeron processors in FC-PGA/

FC-PGA2 and PPGA packages are supplied with unattached fan heatsinks.

This section documents motherboard and system requirements for the fan heatsink that is supplied

with the boxed Intel Celeron processor. This section is particularly important for OEMs that

manufacture motherboards for system integrators. Unless otherwise noted, all figures in this

section are dimensioned in inches.

Note: Drawings in this section reflect only the specifications of the Intel boxed processor product. These

dimensions should not be used as a generic keepout zone for all heatsinks. It is the system

designer’s responsibility to consider their proprietary solution when designing to the required

keepout zone on their system platform and chassis. Refer to the package specific Thermal /

Mechanical Solution Functional Specifications for further guidance. Contact your local Intel Sales

Representative for these documents.

6.1 Mechanical Specifications for the Boxed Intel

Celeron

Processor

6.1.1 Mechanical Specifications for the S.E.P. Package

This section documents the mechanical specifications of the boxed Celeron processor fan heatsink

in the S.E.P. Package. The boxed processor in the S.E.P. Package ships with an attached fan

heatsink. Figure 31 shows a mechanical representation of the boxed Intel Celeron processor in a

S.E.P. Package in the retention mechanism, which is not shipped with the boxed Intel Celeron

processor.

The space requirements and dimensions for the boxed processor in the S.E.P. Package are shown in

Figure 32 and Figure 33. Also, a conceptual attachment interface to low profile retention

mechanism is shown in Figure 38.

Note: The heatsink airflow keepout zones found in Table 57 and Figure 38 refer specifically to the boxed

processor’s active fan heatsink. This does not reflect the worst-case dimensions that may exist with

other third party passive or active fan heatsinks.

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Intel BK80524P533128 Datasheet Page 110