Intel CELERON 200 User Manual download pdf (Page 10)

Introduction

10 Thermal and Mechanical Design Guidelines

Term Description

– T

) / Total Package Power.

Note: Heat source must be specified for Ψ measurements.

TIM

Thermal Interface Material: The thermally conductive compound between the

heatsink and the processor die surface. This material fills the air gaps and voids,

and enhances the transfer of the heat from the processor die surface to the

heatsink.

Processor total power dissipation (assuming all power dissipates through the

processor die).

TDP

Thermal Design Power: a power dissipation target based on worst-case

applications. Thermal solutions should be designed to dissipate the thermal

design power.

USAGE

Maximum usage power of processor when running SysMark utility.

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Intel CELERON 200 User Manual Page 10