Intel BOXDZ68BC Datasheet download pdf (Page 4)

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• Intel® Core™ i7 processors in the LGA 1155 package

Intel® Turbo Boost Technology

• Intel® Hyper-Threading Technology

• Integrated Memory Controller with support for up to

32 GB

of system memory DDR 3 1600 + O.C. SDRAM

• Intel® Fast Memory Access

• Supports Intel® 64 architecture

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

• Intel® Z68 PCH

• Intel® Rapid Storage Manager (RAID 0, 1, 5, 10)

• Intel® Smart Response Technology

• Four SATA (6.0 Gb/s), four SATA (3.0 Gb/s) ports

and one eSATA (6.0 Gb/s)

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• Six Hi-Speed USB 2.0 ports via back panel, including two

fast charging high current ports (yellow)

• Eight additional Hi-Speed USB 2.0 ports via four internal

headers

• Two Super-Speed USB 3.0 ports (blue) and two Super-

-Speed USB 3.0 via internal headers

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• 32 Mb Flash EEPROM with Intel® Platform Innovation

Framework for EFI Plug and Play, IDE drive auto-congure

• Advanced conguration and power interface V3.0b, DMI 2.5

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• Fast Boot

• Intel® Express BIOS update support: BIOS update

via F7 function key

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• Processor fan speed control

• System chassis fan speed control

• Voltage and temperature sensing

• Fan sensor inputs used to monitor fan activity

• Power management support for ACPI 3.0 b



• Intel® LAN on the back panel

• New low-power design can meet Energy Star* 5.0

specications

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• Two PCI Express*

16 connectors (congured as

8 in

dual graphics mode)

• Two PCI Express 2.0

1 slots

• Three PCI slots

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• 10-channel Intel® High Denition Audio

codec

• 8-channel via the back panel

• 2-channel via the front panel

• Back panel support for output via optical cable

• One internal header for S/PDIF output for HDMI* support

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

• Four 240-pin DIMM connectors supporting dual-channel

memory. Two double-sided DIMMs per channel

• Maximum system memory up to 32 GB

using 8 GB

double-sided DIMMs

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• DDR3 1600 + O.C. SDRAM memory support

• Non-ECC Memory

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• 1.35 V low voltage

• 1.5 V standard JEDEC voltage

• Support for Intel® XMP extended voltage proles



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• Single conguration jumper design

• Jumper access for BIOS maintenance mode

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• Reset, HD LED, Power LEDs, power on /off

• Four front-panel Hi-Speed USB 2.0 headers

• One front-panel Super-Speed USB 3.0 headers

• Front-panel audio header

• One IEEE 1394a header

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

• ATX



• 11.6¨

9.6¨ (29.46 cm

24.38 cm)

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• ATX 12 V

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• 0° C to + 55° C

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• –20° C to +70° C

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

UL 1950, Third edition – CAN/CSA C22.2

No. 950-95 with recognized U.S. and Canadian

component marks

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Nemko certied to EN 60950 International

Nemko certied to IEC 60950 (CB report with

CB certicate)

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



FCC Part 15, Class B

FCC Part 15, Class B open-chassis

(cover off) testing

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ICES-003, Class B

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EMC directive 89/336/EEC; EN 55022:1998

Class B; EN 55024:1998

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AS/NZS 3548, Class B



CNS 13438, Class B International

CISPR 22:1997, Class B

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Complies with US CRF via EN55022 +6 db in system congura-

tions with an open chassis and EU Directive 89/336/EEC and

use via EN55022 and EN50082-1 in a representative chassis.

Lead-Free: The symbol is used to identify electrical and elec-

tronic assemblies and components in which the lead (Pb) con-

centration level in any of the raw materials and the end product

is not greater than 0.1% by weight (1000 ppm). This symbol is

also used to indicate conformance to lead-free requirements and

denitions adopted under the European Union’s Restriction on

Hazardous Substances (RoHS) directive, 2002/95/EC.

1 Warning: Altering clock frequency and/or voltage may (i) reduce system stability

and useful life of the system and processor; (ii) cause the processor and other

system components to fail; (iii) cause reductions in system performance; (iv) cause

additional damage; and (v) affect system data integrity. Intel has not tested, and

does not warranty, the operation of the processor beyond its specications.

2 Responsive performance measurements performed using Intel Core Processor, Intel

Z68 Express Chipset, Intel® Solid-State Drive, and Intel® Rapid Storage Technology

driver. Performance as measured by PCMark Vantage v1.0.1 tests on systems with

Intel DZ68BC motherboard, Intel Core processor, Intel 6 Series chipset, Microsoft

Windows* 7 Ultimate 64-bit, SATA 2 for both SSD and HDD, Hitachi 7200 RPM

320 GB HDD, Intel 20 / 40 / 80 GB Solid-State Drives, Integrated Graphics, 4 GB

1066 MHz DDR 3 DRAM. System performance improvement on platforms is con-

guration-dependent; as measured by PCMark* Vantage tests. Boot times taken

with Microsoft Velocity v4.3 and Microsoft PwrTest (included in Microsoft WDK,

for S4 times only).

3 OC Assistant software and BIOS capability for this features may be available shortly

after launch of product.

4 Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost

Technology capability. Intel Turbo Boost Technology performance varies depend-

ing on hardware, software, and overall system conguration. Check with your PC

manufacturer on whether your system delivers Intel Turbo Boost Technology.

See www.intel.com/technology/turboboost for more information.

5 Intel® Hyper-Threading Technology requires a computer system with a proces-

sor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and

For ordering information, visit



For the most current product information, visit



operating system. Performance will vary depending on the specic hardware and

software you use. For more information including details on which processors

support HT Technology, see www.intel.com/info/hyperthreading.

6 Maximum peak memory bandwidth requires four DDR 3 modules to be populated

in each of the blue memory slots. DDR 3 2400 memory support on this motherboard

requires advanced knowledge of BIOS and memory tuning; individual results may

vary. For specic supported memory for this motherboard, please visit www.intel.

com/products/motherboard/ for more details.

7 Intel® High Denition Audio requires a system with an appropriate Intel® chipset

and a motherboard with an appropriate codec and the necessary drivers installed.

System sound quality will vary depending on actual implementation, controller,

codec, drivers, and speakers. For more information about Intel® HD Audio, refer

to www.intel.com/design/chipsets/hdaudio.htm.

8 64-bit computing on Intel® architecture requires a computer system with a proces-

sor, chipset, BIOS, operating system, device drivers, and applications enabled for

Intel® 64 architecture. Processors will not operate (including 32-bit operation)

without an Intel 64 architecture-enabled BIOS. Performance will vary depending

on your hardware and software congurations. See http://developer.intel.com/

technology/intel64/index.htm for more information.

9 System resources and hardware (such as PCI and PCI Express*) require physical

memory address locations that can reduce available addressable system memory.

This could result in a reduction of as much as 1 GB or more of physical addressable

memory being available to the operating system and applications, depending on the

system conguration and operating system.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PROD-

UCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY

INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT

AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,

INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS

OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS

INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR

PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR

OTHER INTELLECTUAL PROPERTY RIGHT.

Intel products are not intended for use in medical, life-saving, or life-sustaining ap-

plications. Intel may make changes to specications and product descriptions at any

time, without notice.

All products, dates, and gures specied are preliminary based on current expecta-

tions, and are subject to change without notice. Availability in different channels

may vary.

Actual Intel® Desktop Board may differ from the image on the box.

Core are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

0911/ FB / HBD / PDF 326025-001US

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Technical Specications

Extreme Series

1 2 3 4

Extreme Series 1

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Intel BOXDZ68BC Datasheet Page 4

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