Intel BOXDH77KC Datasheet download pdf (Page 4)

Europe

(Low Voltage Directive 2006 / 95 / EC)

EN 60950-1

International

IEC 60950-1

EMC Regulations (Class B)

United States

FCC CFR Title 47, Chapter I, Part 15, Subparts A / B

Canada

ICES-003

Europe

(EMC Directive 2004 / 108 / EC)

EN 55022 and EN 55024

Australia / New Zealand

EN 55022

Japan

VCCI V-3, V-4

South Korea

KN-22 and KN-24

Taiwan

CNS 13438

International

CISPR 22

Environmental Compliance

Europe

Europe RoHS (Directive 2002/95/EC)

WEEE (Directive 2002/96/EC)

China

China RoHS (MII Order # 39)

PROCESSOR

Processor Support

•The2ndand3rdgenerationIntel®Core™i7

 andIntel®Core™i5processors,andotherIntel®

processors in the LGA1155 package

•SupportsIntel®64architecture

CHIPSET

Intel® H77 Express Chipset

•Intel®82H77PlatformControllerHub(PCH)

Peripheral Connectivity

•TwoSATA6.0Gb/sports

•ThreeSATA3.0Gb/sports

•OneeSATA3.0Gb/sport

•FourSuperSpeedUSB3.0portswith5.0Gb/slink

speed (two back panel ports and two additional

ports via one internal header)

•TenHi-SpeedUSB2.0ports(Fourbackpanelports,

 fourportsviatwointernalheadersandtwoports

via PCI Express* Mini Card connector)

System BIOS

•64MbFlashEEPROMwithIntel®Platform

 InnovationFrameworkforEFIPlugandPlay

•Advancedconfigurationandpowerinterface

 V3.0b,SMBIOS2.5

•Intel®ExpressBIOSupdatesupport

Hardware Management Features

•Processorfanspeedcontrol

•Frontandrearsystemchassisfanspeedcontrol

•Voltageandtemperaturesensing

•Fansensorinputsusedtomonitorfanactivity

•ACPI-compliantpowermanagementsupport

Intel® Turbo Boost Technology—maximum single-core turbo

frequency (GHz). Intel Turbo Boost Technology requires a PC

with a processor with Intel Turbo Boost Technology capability.

Intel Turbo Boost Technology performance varies depending on

hardware, software, and overall system conguration. Check

with your PC manufacturer on whether your system delivers

Intel Turbo Boost Technology. See www.intel.com/technology/

turboboost for more information.

Intel® Hyper-Threading Technology requires a computer

system with a processor supporting HT Technology and an

HT Technology-enabled chipset, BIOS, and operating system.

Performance will vary depending on the specic hardware and

software you use. See www.intel.com/info/hyperthreading for

more information.

DDR3 1600 memory is only supported by the 3rd generation

Intel® Core™ processors.

System resources and hardware (such as PCI and PCI Express*)

require physical memory address locations that can reduce avail-

able addressable system memory. This could result in a reduction

of as much as 1 GB or more of physical addressable memory being

available to the operating system and applications, depending on

the system conguration and operating system.

Intel® Desktop Board DH77KC Media Series

Technical Specications

Intel® PRO 10/100/1000 Network Connection

•Low-powerdesign

Expansion Capabilities

•OnePCIExpress3.0x16connector

•OnePCIExpress2.0x1connector

•OnePCIExpress2.0x4connector

•ThreePCIconnectors

•OnePCIExpressMiniCardconnectorwithsupport

 formSATASolid-StateDrive

Audio

•7.1+2multi-streamingIntel®HighDefinitionAudio

•Fivestackanalogaudioportsandoneoptical

S/PDIF out port

•InternalS/PDIFheaderandfrontpanelaudioheader

Video

•DisplayPort*+HDMI*+DVI-I:supportdual

 independentdisplayforIntelprocessorswith

 Intel®HDGraphics

SYSTEM MEMORY

Memory Capacity

•Four240-pinDIMMconnectorssupportingupto

 fourdouble-sidedDIMMs

•Maximumsystemmemoryupto32GB

using

8 GB double-sided DIMMs

Memory Types

•DDR31600

/1333/1066SDRAMmemorysupport

•Non-ECCMemory

•Dual-orsingle-channeloperationsupport

Memory Voltage

•Memoryvoltagecontrolfrom1.2Vto1.8V

•1.5VstandardJEDECvoltage

JUMPERS AND FRONT PANEL CONNECTORS

Jumpers

•JumperaccessforBIOSmaintenancemode

Front-Panel Connectors

•Reset,HDLED,PowerLEDs,poweron/off

•Front-panelaudioheader

Other Connectors

•ConsumerIRemitter/receiverheaders

•Chassisintrusiondetectheader

•Oneserialportheader

•Oneparallelportheader

MECHANICAL

Board Style

•ATX

Board Size

•9.6”x11.6”(24.38cmx29.46cm)

Baseboard Power Requirements

•ATX12V

ENVIRONMENT

Operating Temperature

•0°Cto+55°C

Storage Temperature

•-20°Cto+70°C

REGULATIONS AND SAFETY STANDARDS

United States

 UL60950-1

Canada

 CAN/CSA-C22.2No.60950-1

For ordering information, visit www.intel.com

For the most current product information, visit

www.intel.com/products/motherboard

Intel® High Denition Audio requires a system with an appropri-

ate Intel® chipset and a motherboard with an appropriate codec

and the necessary drivers installed. System sound quality will

vary depending on actual implementation, controller, codec,

drivers, and speakers. For more information about Intel® HD

Audio, refer to www.intel.com/design/chipsets/hdaudio.htm

Responsive performance measurements are performed using

the Intel® Core™ processor, Intel® Z68 Express Chipset, Intel®

Solid-State Drive, and Intel® Rapid Storage Technology driver.

Performance as measured by PCMark* Vantage v1.0.1 tests

on systems with the Intel® Desktop Board DZ68BC, Intel Core

processor, Intel® 6 Series Chipset, Microsoft* Windows* 7 Ulti-

mate 64-bit, SATA 2 for both SSD and HDD, Hitachi* 7200 RPM

320 GB HDD, Intel® 20/40/80 GB Solid-State Drives, Integrated

Graphics, 4 GB 1066 MHz DDR3 DRAM. System performance

improvement on platforms is conguration-dependent; as

measured by PCMark Vantage tests. Boot times taken with

Microsoft Velocity v4.3 and Microsoft PwrTest (included in

Microsoft WDK, for S4 times only)

PCI Express* 3.0 support requires select 3rd generation Intel®

Core™ processors.

64-bit computing on Intel® architecture requires a computer sys-

tem with a processor, chipset, BIOS, operating system, device

drivers, and applications enabled for Intel® 64 architecture.

Processors will not operate (including 32-bit operation) without

an Intel 64 architecture-enabled BIOS. Performance will vary

depending on your hardware and software congurations. See

http://developer.intel.com/technology/intel64/index.htm for

more information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION

WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY

RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,

INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DIS-

CLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO

SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY

OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR

PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PAT-

ENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.

Intel products are not intended for use in medical, life-saving,

or life-sustaining applications. Intel may make changes to speci-

cations and product descriptions at any time, without notice.

All products, dates, and gures specied are preliminary based

on current expectations, and are subject to change without

notice. Availability in different channels may vary.

Actual Intel® Desktop Board may differ from the image shown.

Intel, the Intel logo, Intel Inside, and Intel Core are trademarks

of Intel Corporation in the U.S. and other countries.

* Other names, brands, and logos may be claimed as the property

of others.

0312/FZ/MS/PDF

327074-001US

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